With comprehensive experience in ASIC, FPGA and ASSP sales, in both small and large companies, Lancia is well suited to service eASIC Structured ASIC Customers
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Fred has more than 24 years experience in the semiconductor industry. His expertise is in creating and managing world-class sales and marketing organizations, building customer relationships, achieving designs wins, and driving revenue growth. Fred was previously Vice President of Sales & Product Marketing for KeyEye Communications and Vice President of Sales for GCT Semiconductor. Before that he was Vice President of Marketing for Metalink and Director of Asia Pacific Sales for Level One Communications. Earlier, Fred was with programmable logic supplier Lattice Semiconductor, ASIC supplier Fujitsu Microelectronics, and AMD. Fred holds a B.S.E.E. from Ohio State University, an M.S.E.E. from Stanford University, and an M.B.A. from the Kellogg Graduate School of Management at Northwestern University.
"We are pleased to add an industry veteran to lead the company's sales effort and strengthen our management team," said Ronnie Vasishta, eASIC President and CEO. "Fred Lancia joins eASIC at a perfect time, when the industry is seeking a cost-effective custom design solution and eASIC is ready with its disruptive technology and innovative products to answer their ever growing needs. Fred brings with him a wealth of engineering and sales knowledge in ASIC and FPGA designs, as well as in more vertically focused products, working at both large companies and small start ups. As the company is moving to the next growth stage, the revamped leadership team will contribute to building a successful business with a strong customer-focus and a clear completive advantage. Our aim is not just to meet revenue goals, but to excel and exceed the targets, providing maximum customer satisfaction."
"I am excited to join eASIC in the cusp of creating a paradigm shift in the main-stream semiconductor design by reinventing the way of doing custom logic," said Fred Lancia, eASIC's Vice President of Sales. "The Nextreme Structured ASIC product suite provides the customers with unique advantages in terms of cost, turnaround and performance. Removing mask charges and providing ease-of-design as well as production flexibility, allow eASIC to serve a broad range of customers who are eager to have an affordable custom logic solution. Nextreme is a value-added alternative to FPGAs and other ASIC technologies, as it offers an optimized solution which is a perfect fit for a variety of industrial and digital consumer applications, among others."
About eASIC
eASIC is a fabless semiconductor company offering breakthrough Structured ASIC devices aimed at dramatically reducing the overall fabrication cost and time of customized semiconductor chips. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology of FPGA-like programmable logic coupled with ASIC-like Via-layer customizable routing. This innovative fabric efficiently employs mask-less customization with Direct-write e-Beam, and thus allows eASIC to offer zero mask-charge Structured ASICs.
Founded in 1999, eASIC Corporation is privately held, headquartered in Santa Clara, California. Investors include Vinod Khosla, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, and Evergreen Partners. www.eASIC.com .
Contact:
Tsipi Landen
Email Contact
Tel: (408) 855-9200 x220
http://www.easic.com
Web site: http://www.easic.com/
