On November 15, 2022, Amkor’s Board of Directors announced a 50% increase in the company’s quarterly cash dividend, from $0.05 per share to $0.075 per share, on the company’s common stock. The increase was effective with the dividend paid on December 27, 2022. The declaration and payment of future dividends, as well as any record and payment dates, are subject to the approval of the Board of Directors.
Business Outlook
The following information presents Amkor’s guidance for the first quarter 2023 (unless otherwise noted):
- Net sales of $1.40 billion to $1.50 billion, a year-on-year decrease of 9% at midpoint
- Gross margin of 10.5% to 13.5%
- Net income of $15 million to $55 million, or $0.06 to $0.22 per diluted share
- Full year 2023 capital expenditures of approximately $800 million
Conference Call Information
Amkor will conduct a conference call on Monday, February 13, 2023, at 5:00 p.m. Eastern Time. This call may include material information not included in this press release. To access the live audio webcast and the accompanying slide presentation, visit the Investor Relations section of Amkor’s website, located at ir.amkor.com. The live call can also be accessed by dialing 1-877-407-4019 or 1-201-689-8337.
About Amkor Technology, Inc.
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. For more information visit amkor.com.
AMKOR TECHNOLOGY, INC. Selected Operating Data |
|||||||||
|
Q4 2022 |
|
Q3 2022 |
|
Q4 2021 |
|
2022 |
|
2021 |
Net Sales Data: |
|
|
|
|
|
|
|
|
|
Net sales (in millions): |
|
|
|
|
|
|
|
|
|
Advanced Products (1) |
$1,488 |
|
$1,640 |
|
$1,273 |
|
$5,368 |
|
$4,409 |
Mainstream Products (2) |
418 |
|
444 |
|
452 |
|
1,724 |
|
1,729 |
Total net sales |
$1,906 |
|
$2,084 |
|
$1,725 |
|
$7,092 |
|
$6,138 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| Packaging services |
88 % |
|
87 % |
|
86 % |
|
87 % |
|
86 % |
| Test services |
12 % |
|
13 % |
|
14 % |
|
13 % |
|
14 % |
|
|
|
|
|
|
|
|
|
|
|
| Net sales from top ten customers |
67 % |
|
67 % |
|
66 % |
|
65 % |
|
63 % |
|
|
|
|
|
|
|
|
|
|
|
| End Market Distribution Data : |
|
|
|
|
|
|
|
|
|
| Communications (smartphones, tablets) |
50 % |
|
47 % |
|
42 % |
|
44 % |
|
41 % |
| Automotive, industrial and other (ADAS, electrification, infotainment, safety) |
20 % |
|
18 % |
|
20 % |
|
20 % |
|
21 % |
| Consumer (AR & gaming, connected home, home electronics, wearables) |
17 % |
|
20 % |
|
22 % |
|
20 % |
|
22 % |
| Computing (data center, infrastructure, PC/laptop, storage) |
13 % |
|
15 % |
|
16 % |
|
16 % |
|
16 % |
| Total |
100 % |
|
100 % |
|
100 % |
|
100 % |
|
100 % |
|
|
|
|
|
|
|
|
|
|
|
| Gross Margin Data: |
|
|
|
|
|
|
|
|
|
| Net sales |
100.0 % |
|
100.0 % |
|
100.0 % |
|
100.0 % |
|
100.0 % |
| Cost of sales: |
|
|
|
|
|
|
|
|
|
| Materials |
55.1 % |
|
53.3 % |
|
47.4 % |
|
51.4 % |
|
46.1 % |
| Labor |
9.0 % |
|
8.6 % |
|
11.4 % |
|
10.0 % |
|
12.3 % |
| Other manufacturing |
18.4 % |
|
17.9 % |
|
20.2 % |
|
19.8 % |
|
21.6 % |
| Gross margin |
17.5 % |
|
20.2 % |
|
21.0 % |
|
18.8 % |
|
20.0 % |
| (1) |
Advanced products include flip chip, memory and wafer-level processing and related test services. |
|
| (2) |
Mainstream products include all other wirebond packaging and related test services |
