The 32nm silicon results provide a rich and expansive data set modeling the HKMG process in relation to layout rules, design rule checking and device interconnect models. In addition, they capture critical information related to device and interconnect variability, including systematic, random, within-die and die-to-die variation, as well as manufacturing effects including lithography, thermal, stress, proximity effects, and copper deposition. Using this manufacturing intelligence during the physical design process, the Cadence Encounter Digital Implementation System can enable early and silicon-accurate DFM and variability modeling, characterization and optimization to provide a complete end-to-end flow.
"We've worked closely with Cadence to build early hardware for the purpose of accurately modeling device and interconnect variability," said Mark Ireland, vice president, IBM Semiconductor Platforms on behalf of the Common Platform alliance. "The early learning will enable Cadence to incorporate silicon-accurate models and DFM support into the Encounter tool suite. This helps accelerate the adoption of 32/28nm high-k metal-gate technology for designers to deliver next-generation devices with significantly improved performance and battery life."
The EDI System contains a full suite of DFM and statistical technologies that can be applied across the physical implementation flow. Manufacturing and yield can be addressed concurrently with timing, signal integrity, power, and area optimizations to ensure all aspects are addressed holistically before final tapeout. By modeling and optimizing for variability early in the design stage, designers reduce overall turnaround time and improve confidence that the chip will work as intended. Once these technologies are validated on 32/28nm technology, there is a potential to increase design predictability, resulting in higher-quality silicon with better time to volume.
"With this announcement, Cadence demonstrates industry leadership with innovative manufacturing partnerships," said Chi-Ping Hsu, senior vice president of Research and Development for the Implementation Products Group at Cadence. "The Cadence and Common Platform alliance collaboration on 32/28nm is yet another testimony to our long-term investment and commitment to advanced technology development. Cadence continues its quickened pace of product and technology leadership to help our customers bring their leading-edge products first to market."
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
Cadence, the Cadence logo, and Encounter are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.
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For more information, please contact: Dan Holden Cadence Design Systems, Inc. 408-944-7457 Email Contact
