Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform

SAN JOSE, Calif., Oct. 11, 2017 — (PRNewswire) — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Hiroshima University is using Cadence® technology in its development of a computer-aided diagnosis system for colorectal endoscopic images. Led by Associate Prof. Koide of the Research Institute for Nanodevice and Bio Systems (RNBS), the team developed the computer-aided diagnosis system using the Cadence Tensilica® Vision P6 digital signal processor (DSP) core for convolutional neural network (CNN) processing and support vector machine (SVM) classification, and brought up the software and verified the system using the Cadence Protium S1 FPGA-Based Prototyping Platform. With the help of Cadence Tensilica technology, the Hiroshima University project has demonstrated a 35X reduction in image processing time, enabling real-time processing of diagnostic images for the healthcare market.  

Cadence Logo. (PRNewsFoto/Cadence Design Systems, Inc.) (PRNewsFoto/CADENCE DESIGN SYSTEMS_ INC_) (PRNewsFoto/CADENCE DESIGN SYSTEMS, INC.)

Due to the increase in the number of colorectal cancer patients in recent years, a diagnosis system capable of presenting additional image analysis information to physicians has been desired to aid in early detection. Such a system needs to evaluate pathology type in high definition (1920 x 1080 pixel) using the features extracted with narrow band imaging (NBI) magnification, while offering high estimation accuracy and enabling real-time response for clinicians.

To address this need, Hiroshima University developed an approach using the configurable Vision P6 DSP to perform CNN processing for feature extraction from the endoscopic images and SVM for the pathology type identification, improving computational efficiency for this high-complexity processing. Furthermore, the software development and verification was finalized with the Protium S1 platform, ensuring early and proper system functionality. For more information on the Tensilica Vision P6 DSP, please visit https://www.cadence.com/go/visionp6dsp. For more information on the Protium S1 FPGA-Based Prototyping Platform, please visit http://www.cadence.com/go/protiumhiroshima.

The Vision P6 DSP efficiently executes both image processing and CNN processing, which are indispensable in deep learning. It supports image processing and CNN processing on a flexible high-performance DSP core. Through this deployment, the Hiroshima University has demonstrated that the system meets the requirement for real-time processing, low latency and estimation accuracy.

The Protium S1 platform, part of the Cadence Verification Suite, is designed for early, pre-silicon software development and significantly improves productivity by reducing prototype bring-up time from months to weeks compared to competitive solutions. The platform let the research team verify the system's performance early in the process, allowing for the early identification of bugs, speeding up development time. For more information on the Verification Suite, please visit http://www.cadence.com/go/verification_suite.

"To meet our end goal of producing a diagnostic system that can be functional in a clinical application, it is necessary for the system to process images in real time and with low latency during an endoscopic examination," said Associate Prof. Koide of RNBS at Hiroshima University. "Through our use of the Cadence Tensilica Vision P6 DSP core and the Protium S1 FPGA-Based Prototyping Platform, we were able to reduce the image processing time and optimize our co-design of software and hardware, creating a more streamlined development process. The Cadence technology was instrumental in allowing us to develop a tool that met medical needs for performance and precision."

About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company's System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at cadence.com.

© 2017 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

For more information, please contact:
Cadence Newsroom
408-944-7039
newsroom@cadence.com

 

View original content with multimedia: http://www.prnewswire.com/news-releases/hiroshima-university-research-team-accelerates-the-development-of-a-computer-aided-medical-diagnosis-system-with-cadence-tensilica-vision-p6-dsp-core-and-protium-s1-fpga-based-prototyping-platform-300535187.html

SOURCE Cadence Design Systems, Inc.

Contact:
Cadence Design Systems, Inc.
Web: http://www.cadence.com

Featured Video
Jobs
Design Verification Engineer for Blockwork IT at Milpitas, California
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
Sr. Silicon Design Engineer for AMD at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
GPU Design Verification Engineer for AMD at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
Upcoming Events
Phil Kaufman Award Ceremony and Banquet to be held November 6 at Hayes Mansion at Hayes Mansion 200 Edenvale Ave San Jose CA - Nov 6, 2024
SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024
DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024
SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise