"Mobile device manufacturers are seeking new ways to innovate and improve the user interface capabilities in their products. Replacing commodity capacitive technologies with Sentons' ultrasound-based sensing technology enables the application of touch sensing not only on glass but also on metal and curved surfaces. It also allows force and pressure sensing with zero deformation of the touch surface," said Sam Sheng, CEO at Sentons. "This technology is centered around sophisticated new algorithms running on the Cadence Tensilica ConnX BB32EP DSP. A powerful 32-way MAC SIMD, 5-issue VLIW DSP with outstanding support for complex vector and matrix advanced algebra, the BB32EP's high performance and low power were the perfect match for Sentons' new SoC."
"Sentons' highly innovative signal processing was enabled by a Tensilica heterogeneous multicore solution including the ConnX BB32EP and an Xtensa® controller that provides outstanding complex signal processing performance in a low-power envelope for mobile applications," said Chris Jones, group director of DSP Marketing at Cadence. "Supported by a complete, industry-proven set of tools and libraries, Tensilica provided an ideal solution for Sentons' new ultrasound technology."
For more information about the Tensilica ConnX BB32EP DSP, visit http://ip.cadence.com/ipportfolio/tensilica-ip/comms-dsp.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.
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