Reduces mounting area by 90%
TOKYO — (BUSINESS WIRE) — March 26, 2014 — Toshiba Corporation (TOKYO:6502) today announced the launch of ultra-small chip scale package white LEDs for lighting applications that can reduce the mounting area by 90% compared to conventional 3.0 x 1.4 mm package products. [1] The new “TL1WK series” will start sample shipment from April.
Toshiba: Ultra-Small Chip Scale Package White LEDs for Lighting Applications (Photo: Business Wire)
The new products utilize gallium nitride-on-silicon (GaN-on-Si) process technology and a new process technology that fabricates the elements of a packaged LED on an 8-inch silicon wafer. The LEDs are the industry’s smallest in sub-watt class (1/4-1/2W) white LEDs[2], with a package size of just 0.65 x 0.65mm, but they achieve a luminous efficacy of 130lm/W[3] and superior heat dissipation. Using the new white LEDs makes it possible to achieve a narrow beam in small-size lighting equipments and can contribute to innovation in lighting design.
The new white LEDs will be showcased at “Light+Building”, a trade fair for lighting and architecture in Frankfurt, Germany from March 30 to April 4.
Applications
Light sources for general lighting, including straight tube lights, light bulbs and ceiling lights
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Main Specifications of the New Products |
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| Series Name | TL1WK Series | |
| Package Size | 0.65 x 0.65 mm (Typ.) | |
| Color Temperature | 5000K | |
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Color Rendering Index
(Ra) |
80 (Min) | |
| Forward Current | 180mA (Max) | |
| Luminous Efficacy | 130lm/W (Typ.) | |
| Others |
Color variations under planning
(4000K, 3000K, 2700K) |
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