Cadence Licenses Tensilica ConnX BBE16 DSP to GCT Semiconductor

SAN JOSE, Calif., Feb. 26, 2014 — (PRNewswire) — Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that GCT Semiconductor, Inc. licensed the Cadence® Tensilica® ConnX BBE16 digital signal processing (DSP) core for a next-generation chipset targeting mobile applications. The Tensilica DSP core offers high computation throughput in a small and very low power footprint, coupled with its extensive DSP core roadmap to meet future device computation requirements.

"Using programmability to implement 4G and multi-standard baseband modem functionality can accelerate time-to-market," said Alex Sum, vice president of sales and marketing at GCT Semiconductor. "We are pleased to be working with Cadence to further advance our LTE chipsets. Using the Tensilica ConnX BBE16 DSP core allows chip makers to develop a product that meets the cost and power requirements. It also facilitates a tight integration of existing hardware blocks and the flexibility to tune the modem via software."

The Tensilica ConnX BBE16 DSP core is a very efficient 16-MAC (multiply-accumulate) DSP core that has been optimized for OFDM-based wireless communication modem. It is fully programmable in C, eliminating the need for assembly coding found in other DSPs and also enables easier software development and maintenance.

For more information about the Tensilica ConnX BBE16 DSP, visit http://ip.cadence.com/ipportfolio/tensilica-ip/comms-dsp.

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

© 2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, Tensilica and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

For more information, please contact:
Cadence Newsroom
408-944-7039
Email Contact

SOURCE Cadence Design Systems, Inc.

Contact:
Cadence Design Systems, Inc.
GCT Semiconductor, Inc.
Web: http://www.cadence.com

Featured Video
Editorial
More Editorial  
Jobs
GPU Design Verification Engineer for AMD at Santa Clara, California
Sr. Silicon Design Engineer for AMD at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
Upcoming Events
MEMS & Sensors Executive Congress (MSEC 2024) at Château-Bromont Hotel in Bromont Quebec Canada - Oct 7 - 9, 2024
PCB West 2024 at Santa Clara Convention Center Santa Clara CA - Oct 8 - 11, 2024
DVcon Europe 2024 at Holiday Inn Munich City Center, Munich Germany - Oct 15 - 16, 2024
International Test Conference (ITC) at United States - Nov 3 - 8, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise