Xilinx Vice President Sandeep Bharathi to highlight 2.5-D IC case study, high bandwidth IC design challenges & opportunities in two technology forums on March 21 & 22

SAN JOSE, Calif., March 14, 2012 — (PRNewswire) —  Xilinx, Inc. (NASDAQ: XLNX) today announced its participation at SEMICON China 2012 taking place in Shanghai, China from March 20 through 22.

What: SEMICON China 2012
Where: Shanghai New International Expo Centre, Shanghai, China
When: March 20 – 22, 2012

Xilinx vice president of engineering, Sandeep Bharathi, will join semiconductor industry leaders from around the world in two full-day events on March 21 and 22, respectively: the 3-D IC Technology Forum and China Market: IC from Design to Manufacturing.

Bharathi manages FPGA digital design development at Xilinx, including CAD and FPGA product tape outs, affording him unique insights into advanced chip design and manufacturing challenges and opportunities at 28nm, and in 3-D IC integration and packaging.

The 3-D IC forum will focus on breakthrough 3-D IC integration and packaging technologies being pioneered by today's semiconductor companies to achieve 'more than Moore' in response to end market demand for higher performance, lower power, smaller form factor, lower cost electronic products.

The China IC from design to manufacturing forum will convene prestigious scholars and experts to discuss the growing role of the local IC industry in the broader global semiconductor market, and to share advanced engineering and scientific information, ideas and solutions for the future. The communications sector will be a key area of emphasis for speakers, including: Current IC Manufacturing Technology for Telecommunications, 4G System Architecture, and IC Design in 4G Systems.

3-D-IC Technology Forum
Wednesday, March 21
2:00-2:30 p.m., Kerry Hotel Pudong, Shanghai (Shangri-La Group), Pudong Ballroom 4
2.5-D ICs: Just a Stepping Stone or a Long Term Alternative to 3-D?

Bharathi's talk will cover the progression of 3-D IC technology, challenges of 3-D vs. 2.5-D IC design and manufacturing, highlights from a 2.5-D FPGA case study, and future directions for the industry.

The China Market: IC from Design to Manufacturing
Thursday, March 22
3:00 – 3:30 p.m., Kerry Hotel Pudong, Shanghai (Shangri-La Group), Function Room 4
High Bandwidth IC Design Challenges & Solutions

Bharathi will also deliver a session talk on the challenges facing the communications industry to keep up with the insatiable demand for bandwidth, and how the latest innovations in programmable devices and associated design tools and IP are delivering unprecedented levels of performance while reducing design time.

About SEMI

SEMI is a global industry association serving companies that provide equipment materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS), photovoltaic and related technologies. SEMI maintains offices and hosts programs and activities in every major microelectronics and display manufacturing region around the world.

SEMI exists to advance the growth and prosperity of its members and the industries it serves. SEMI does this by creating and delivering access to markets, customers, investors, suppliers, governments, market information and the global industry community. Through its programs and activities, SEMI promotes the development of the microelectronics and display industries, advances the mutual business interests of its members and encourages fair competition and open markets. For more information, please visit www.semi.org.cn.

About Xilinx

Xilinx is the world's leading provider of programmable platforms. For more information, visit: http://www.xilinx.com/.

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Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners.

 

SOURCE Xilinx, Inc.

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Xilinx, Inc. SEMICON China 2012 Web: http://www.xilinx.com