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-> DAC 2014 Interviews
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Rob Stipek, Business Development Specialist
Moldex3D
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Keywords: IC Packaging Simulation, Moldex3D, Chip Encapsulation, Chip Package Analysis, IC Design Optimization, Rob Stipek, 2014 DAC
Description: Interview with Rob Stipek, Business Development Specialist at Moldex3D at 2014 Design Automation Conference.
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