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High-Speed Serial Link: Full-Wave EM Modeling Methodology and Measurement Correlation
CST - Computer Simulation Technology
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| Keywords: crosstalk, PCB, connector |
| Description: Passive channels pose significant challenges to serial link transmission for single-ended buses running at very high speeds. With More » |
| Description: Passive channels pose significant challenges to serial link transmission for single-ended buses running at very high speeds. With the combined increase in data rates and routing density, crosstalk has become a major source of noise in current PCB designs. Reduced bit-to-bit, bytelane-to-bytelane and channel-to-channel spacing makes timing/voltage active margin analysis more challenging especially for single-ended and bidirectional buses. For this reason simulating a full pad-to-pad link is becoming increasingly desirable. Being able to quickly identify worst case lanes and quantify crosstalk impact is crucial. Such an approach is still very challenging especially for complex systems where the location and nature of aggressor signals change when moving from one component (package, board and connector) to the next. « Less |
