SAN JOSE, Calif. — (BUSINESS WIRE) — July 6, 2011 — Tessera Technologies, Inc. (Nasdaq: TSRA) will be exhibiting its advanced semiconductor packaging technologies at SEMICON West, July 12-14, 2011, at booth #6144 in Moscone Center’s North hall.
Tessera will also participate in a panel at the event.
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WHO: |
Charles Woychik, Director of Marketing and Technical Analysis, Invensas |
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Corporation, a wholly owned subsidiary of Tessera |
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WHAT: |
Design and Manufacturing Panel: Stacking Effects; A look at how the global |
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supply chain will change in 2.5D and 3D |
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WHERE: |
SEMICON West 2011 | ||
| Moscone Center | |||
| NorthTwo TechXPOT | |||
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San Francisco, California |
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WHEN: |
July 12, 2011 | ||
| 11:40am – 12:45pm | |||
