Lineup for 2011 Collaboration & Interoperability Congress

Lineup for 2011 Collaboration & Interoperability Congress Announced

Expert Speakers to Present at Unique Industry Event

LOVELAND, Colo., April 5, 2011 — (PRNewswire) — Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today announced its lineup of speakers for the 2011 event. The agenda is available at the congress website, www.3dcic.com.

Now in its eighth year, the annual CIC ( www.3dcic.com) brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.

The CIC program is highlighted by the following information-packed presentations and panels of industry experts:

*Challenges and Solutions in Development and Design*
Dick Morley, Director of Innovation, Cyon Research; Founder, "The Barn"
*Countering the Braindrain Threat to Engineering*
by Kiho Sohn, (former) Chief Knowledge Officer, Pratt & Whitney Rocketdyne
*Accelerating Innovation in Today's Engineering Organization*
by Chad Jackson, President and Founder of Lifecycle Insights
*Overview & Status of Model-Based Enterprise (MBE) Standards*
by Ric Norton, Program Manager and Technical Data Analyst for the Defense Logistics Agency (DLA) Logistics Information Service
*If You Build It, Will They Come? – PMI from the other side*
by John Callen, Product Manager, Inventor PLG, Manufacturing Industry Group, Autodesk
*Update on Global LOTAR Status, Activities and Solutions*
by Rick Zuray, Technical Principal, Boeing
*Using Standards & Visualization formats to Implement 3D Manufacturing Instructions for Long Term Data Archiving*
by Trevor Leeson, Consultancy & Services Director, Theorem Solutions
*Trends and Best Practices in Collaboration & Interoperability: Results from the Sixth Annual Survey*
by Dr. David Prawel, President, Longview Advisors Inc.
*Making 3D Product Data Cheap and Available - Added Value with JT and STEP*
By Dr. Andreas Schreiber, President, PROSTEP Inc.
*Incorporating STEP and Collaborative Formats Together into the Product Lifecycle*
by Dr. Nathan Hartman, Assistant Department Head, Department of Computer Graphics Technology, Purdue University; Philip Rosche, Senior Associate, ICF International; Kevin Fischer, Advanced Manufacturing Technology, Rockwell Collins
*Integrated Product Development with CATIA V6 and SAP*
by Reinhard Staebler, Vice President – SAP Solutions, CENIT North America
*Panel: Getting the Most From Your Engineering Organization*
Panelists: Four Senior Engineering Management participants?
*Exploring the Latest Technologies for Accelerating Secure Collaboration*
by Wes Shimanek, Workstation Product Manager, Intel Architecture Group, with guests Nate Nalven, Director Engineering Applications at Northrop Grumman and Chuck Brown, Cloud Technology Director at Intel
*Deploying PLM to Drive Enterprise Collaboration Standards*
by Rick Mihelic, Engineering Systems Manager, Peterbilt Motors Company
*Model-Based Enterprise (MBE) Pilot Programs Overview & Status*
by Rich Eckenrode, President, Recon Services
*Mitigating Risk in PLM Migration - A Tale of Transition*
by Vijay Vasandani, VP & GM, NobleTek
*MBE PLM Technical Data Plan - Definition Update/Status*
by Roy Wittenburg, Project Manager for UTRS, US Army
*Panel B: Empowering Engineering Decision Making*
Panelists: Four Senior Engineering Management
*Automotive Industry Visualization Standards Based Interoperability: A Global Industry Initiative*
by Doug Halliday, Director - Strategic Business Development, Trubiquity
*Leveraging Photorealistic 3D Web Applications in the Cloud for Supply Chain Collaboration*
by Phil Lunn, CTO, Bunkspeed
*Open Source in PLM*
by Marc Lind, Senior Vice President, Aras
*Panel: Collaboration & Interoperability Industry Update*
Panelists: Senior representatives from the Major CAD and Interoperability companies

Corporate sponsors to date of the 2011 Congress include: Actify, Autodesk, CENIT North America, CT Core Technologies, Dassault Systemes, Hewlett-Packard, Intel, ITI TranscenData, Kubotek America, 360 Enterprise Software, mental images, NobleTek, Parametric Technology Corp., Right Hemisphere, Spatial, Techsoft 3D, Theorem Solutions and Trubiquity. Promotional sponsors include the ConnectPress group of CAD communities (e.g. CATIA Community, Pro-E Community, UG Community), Desktop Engineering Magazine, MCADCafe, PDES Inc., and Tenlinks.

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