HEILBRONN, Germany — (BUSINESS WIRE) — February 24, 2010 — Telefunken Semiconductors, as a leading provider of niche analog and mixed signal process technology, today announced that TS700V, a state of the art sub-micron BCD technology featuring a 700V power NMOS, is offered as the latest technology by TS.
The unique combination of sub-micron CMOS with high voltage power electronics, and a dual metal layer option enables a new level of integration. The process offers a competitive on-resistance area product (RDSon x A) enabling cost effective integration of smart power devices.
This technology is ideal for applications such as off-line switching AC/DC converters, LED lighting, and Industrial Motor Control.
TS700V environment (PDK) provides design engineers with the ability to accelerate time to market for highly integrated, low cost, energy efficient solutions for today’s most power sensitive applications. A feature-rich device portfolio equips design engineers to optimize trade-offs when attempting to achieve stringent regulatory requirements such as Energy Star and Blue Angel.
TS 700 V is now available with appropriate NDA and already used by TS customers for designing products on this TS Technology.
TELEFUNKEN Semiconductors is a specialty Analog & Mixed Signal facility with ISO Automotive and Industrial Class Certifications. TS offers state-of-the-art contract semiconductor foundry services at their world class manufacturing location in Heilbronn, Germany. Find out where tradition and innovation meet in one place, right here at www.telefunkensemi.com
TELEFUNKEN Semiconductors 2010
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