• Also in displays, ST, in collaboration with LG Display, proposed the iDP (Internal DisplayPort) interface standard, which is designed to replace the current LVDS (Low Voltage Differential Signaling) standard, to the Video Electronics Standards Association (VESA) TV Panel Task Group. This new standard is being driven by the requirements for richer graphics, 3D video and enhanced picture quality.

• In consumer audio, ST announced its next-generation STA370BWS SoundTerminal™ chip, which delivers increased performance at a highly competitive price. The new chip employs ST's leading-edge Full Flexible Amplifier (FFX™) technology to deliver high-quality stereo audio at 10W and above, in various consumer applications, including the latest ultra-thin LED-backlit Flat TVs. ST's SoundTerminal family is currently enjoying success with strong demand and increased market share at leading OEMs in China, Taiwan, Korea and Japan.

• In imaging, ST unveiled details of its roadmap for 5M-pixel CMOS image sensors in the standard quarter-inch optical format commonly used in camera-phone handsets. ST's latest leading-edge sensors offer a choice of features creating the richest portfolio of sensors at the 5-megapixel resolution.

• In communications infrastructure applications, a device in ST's SPEAr™ family of customizable processors was selected and qualified by a major telecoms company in China, making it ready for implementation in new designs from the manufacturer.

Industrial and Multisegment Sector (IMS) Product Highlights

• In MEMS (Micro Electro-Mechanical Systems), ST launched several new families of motion sensors for multiple consumer and portable applications, including: a broad range of thirteen new single- and two-axis gyroscopes; a high-performance single-package three-axis analog gyroscope; a motion-sensor combo module integrating a three-axis digital accelerometer with a two-axis analog gyroscope; and a range of three-axis accelerometers with digital output that can detect accelerations up to 24g. ST also introduced a high-accuracy sensor for smart applications in vehicles such as adaptive front lights and advanced anti-theft systems.

• ST continued to gain numerous design wins for motion sensors in various applications including: two digital camera manufacturers, one in Korea and another in Japan; an important mobile phone maker in Korea; several netbook and laptop manufacturers for free-fall protection; and a customer in Japan for next-generation gaming platforms.

• Also in MEMS, ST expanded its portfolio with next-generation acoustic MEMS microphones that use technology from OMRON to significantly improve sound quality, reliability, and cost-effectiveness for existing and emerging audio applications in mobile phones, wireless devices and games that respond to voice inputs.

• In remote energy-metering applications, ST announced that it has been chosen by Enel, Italy's largest power company, to provide the semiconductor components for new electronic power meters destined for distribution in Spain. The power meters are key elements of the new remote management solution to be installed by Endesa, the largest electricity supplier in Spain. ST also achieved a design win for a powerline-modem based smart-metering project in Africa from a leading meter manufacturer in Egypt.

• In analog and mixed-signal ICs, ST introduced the first single-chip audio subsystem IC to include 3D sound enhancement for improved stereo effects in equipment such as notebook PCs, mobile internet devices and gaming consoles. Also in the audio field, ST gained a key design win from a world-leading mobile phone maker for a headset audio amplifier. ST also announced a smart-reset chip that allows mobile products experiencing 'system freeze' to be restarted safely without removing the battery or pushing the recessed reset button. Additionally, ST attained a number of design wins for temperature sensor ICs in solid-state disks drives, e-Books and other portable applications.

• In advanced analog, ST introduced a series of highly accurate LED drivers with automatic power saving, enabling electronic signage such as road signs, advertising, stadium displays, battery or solar-powered signs and similar equipment to deliver better high-resolution viewing by ensuring consistent brightness across the viewing area.

• In power conversion ICs, ST gained design wins for controller and high-voltage converter chips in LED-backlit LCD TV power supplies, most significantly with a major TV maker in Korea. ST was also chosen to supply power management ICs for a PC graphics-card platform and gained an important design win for the ST1S10 DC-DC converter IC with an important STB maker in Europe. Launched approximately two years ago, this converter IC has met with considerable success in consumer applications with top-tier OEMs and distributors. In addition, several designs were won for power management ICs, on recently qualified devices, both for linear and switching regulators, in various markets and applications including netbooks, mobile phones, printers and gaming.

• And in power transistors, ST introduced a series of IGBTs that reduce the environmental impact of daily-use equipment such as home appliances, industrial machines and HVAC (Heating/Ventilating/Air Conditioning) systems. ST also gained design wins for ignition IGBTs from several car manufacturers in India. These IGBTs are optimized for pencil coil systems and can help cut noxious emissions and reduce fuel consumption. ST also achieved design wins for power MOSFETs in a range of applications, primarily in consumer and lighting applications. Also, a leading automotive OEM in Europe selected ST's latest STripFET™ VI DeepGATE™ power MOSFETs for use in Antilock Braking Systems.

• In application-specific discrete devices, ST gained an increasing number of design wins in areas such as telecom networking and solar panels for its power Schottky diodes in PowerFlat halogen-free packages, which offer a slim 1.05mm profile and very low thermal resistance, ideal for power conversion applications. ST introduced its first ultra-low Vf power Schoktty diodes for the 80 PLUS power-supply market. In addition, ST introduced a family for protection against 'electrical over-stress' and 'electrical static discharge', specified to IEC 61000-4-5, which is applicable to most telecom and industrial equipment.

• In standard microcontrollers, ST achieved an industry first for MCUs based on ARM Cortex-M processor cores with devices featuring 90nm embedded Flash, leveraging ST's investment in leading-edge embedded-Flash technology for its secure and automotive MCUs to realize performance and cost advantages for the STM32 family.

• In secure MCUs, ST announced its AuKey brand-protection solution, based on ST's ST23 highly secure MCUs, to help brand owners authenticate their products in various applications, including computer accessories, printer consumables, gaming peripherals and disposable medical equipment. ST also introduced a robust low-power processor chip dedicated to managing SIM data for machine-to-machine (M2M) cellular communications applications.

• In smart cards, ST achieved the world's first security certification at level EAL6+ using Common Criteria 3.1 methodology, for a secure MCU that targets security-demanding governmental applications such as passports and identity cards.

• In memory ICs, ST introduced a 2-Kbit IC enabling applications for re-usable contactless tickets for mass transit services, increasing user convenience and operator efficiency.

Technology Highlights

• ST announced its cooperation with Mayo Clinic on a novel platform for the remote monitoring of patients with chronic cardiovascular disease. The platform will provide a comprehensive and unobtrusive solution that monitors person-specific data and physiological parameters and influences lifestyle and treatment choices.

ST-Ericsson Highlights

• LG Electronics selected ST-Ericsson's mobile HSPA (High Speed Packet Access) broadband modem, M340, to power the LG GW990 mobile internet device, which will be launched in the second half of 2010. The M340 is part of the mobile platforms solution, together with the Intel Moorestown solution. The M340 is a small, flexible modem solution with low-power consumption enabling high speed internet access.

• Nokia and ST-Ericsson announced a long-term partnership for technology and solutions in the area of TD-SCDMA, a 3G mobile communications standard in China. The partnership will see Nokia using ST-Ericsson as a key supplier of chipset platforms in its Symbian-based TD-SCDMA devices and solutions portfolio.

• ST-Ericsson, together with Ericsson, also announced the companies successfully achieved first mobility between LTE (Long Term Evolution) and HSPA networks, using a multimode LTE/HSPA device powered by ST-Ericsson's M710 platform.

• ST-Ericsson announced its cooperation with ARM to accelerate innovation in mobile user experience. ST-Ericsson's U8500 is the first smartphone platform to integrate a Mali -400 graphics processing unit providing access to a leading-edge environment for graphics developers.