AUSTIN, Texas — (BUSINESS WIRE) — November 10, 2009 — Silicon Integration Initiative (Si2) announced today its sponsorship of the “3-D Architectures for Semiconductor Integration and Packaging Conference.” This conference will be held December 9-11, 2009, at the Hyatt Regency San Francisco Airport in Burlingame, CA, and is developed by RTI International.
“Si2's member companies recognize the growing business need for designing and integrating circuits in 3-D, as well as the technical challenges that must be solved,” says Sumit DasGupta, sr. vice-president of Engineering at Si2. "Many of our member companies and other interested parties are also calling for new standards in 3D design, which Si2 is currently investigating." At this conference, Dr. DasGupta will be presenting the findings from a recent 3D Standards workshop hosted by Si2 and GSA.
The various performance, size, and cost drivers to the move toward 3-D are well known. Likewise, the various routes and options for implementation of 3-D, whether it is through front-end device manufacturing or in back-end packaging, are often discussed. Near-term market opportunities are widely recognized as well. Regardless of this expanding reality, the situation continues to be very dynamic as technology continues to evolve, and the understanding of cost/performance benefits relative to specific market applications continues to expand. The best path forward, whether from a technology or market standpoint, often remains uncertain.
This year’s conference will provide attendees and speakers the unique opportunity to explore and understand the technology and business implications of the trend toward 3-D device and system integration in the semiconductor industry. Conference Sessions for this year's event include:
• The IDM and Foundry Perspective on 3-D Technology Trends and Opportunities
• The Packaging Foundry and its Vital Role in Driving 3-D
• Looking Over the Horizon - Forecasting Growth
• On the Front - Applications Driving 3-D Development and Commercialization
• Taking Advantage of 3-D - Rethinking Design Approaches
• Industry and Government Funded 3-D Efforts - Key Research Outcomes and Resources
• Fundamental Technology Approaches to Building 3-D
• Wafer Handling Leads the Way on Manufacturing
Registration and additional information is available at: http://techventure.rti.org/Winter2009/.
About Si2
Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to market, reduce costs, and meet the challenges of sub-micron design. Now in its 21st year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents nearly 100 companies involved in all parts of the silicon supply chain throughout the world. See www.si2.org.
Contact:
Silicon Integration Initiative
William Bayer, 512-342-2244, ext. 304