-- In consumer audio, ST expanded its market share for 'Sound Terminal'
products, based on its FFX digital amplification IP, with significant
design wins in TV applications at OEMs in China and Taiwan. ST's
FFX-based audio products also hit cumulative shipments of 5 million
units in 2009.
-- In imaging, ST announced its cooperation with Soitec for the development
of wafer-level backside-illumination (BSI) technology on 300mm wafers
for next-generation CMOS image sensors in consumer products.
-- In computer peripherals, ST gained a design win from a leading
hard-disk-drive manufacturer for a next-generation motor-controller IC,
manufactured in ST's proprietary BCD process, for mobile applications.
Industrial and Multi-Segment (IMS) Product Highlights
-- In microcontrollers, ST announced an ultra-low-power technology platform
for developing a range of 8- and 32-bit microcontrollers. The platform
will enable future generations of electronic products to consume less
power, meet evolving energy-efficiency standards, and operate
significantly longer from their batteries.
-- In RFID applications, ST's robust SRT512 chip was used in an RFID-based
system for re-usable single-journey ticketing in mass transportation;
the system has recently gone live on the Seoul Subway in South Korea.
-- In non-volatile memories, ST was first to market with 512-Kbit EEPROMs
offering SPI and I2C interfaces in an MLP2x3 package.
-- In MEMS (Micro Electro-Mechanical Systems), ST introduced a new family
of single- and multi-axis MEMS gyroscopes that deliver superior
performance and reliability for angular-motion detection in
human-machine interface applications, personal- and car-navigation
systems, and image stabilization for digital still and video cameras.
-- ST also gained several key design wins for its motion-sensing MEMS
accelerometers from world-leading consumer companies for next-generation
mobile products, including MP3 players, smart phones and digital still
cameras. In addition, ST launched the world's thinnest three-axis
digital MEMS accelerometer, which is only 0.75mm high and shares the
3x5mm footprint of other devices in ST's Piccolo MEMS family for use in
ultra-space-saving product designs.
-- In energy solutions, ST announced a commercial agreement with Front-Edge
Technology, a leading developer of next-generation rechargeable
batteries. This agreement enables ST to bring ultra-thin lithium battery
technology to a range of markets and applications.
-- In filtering and protection ICs, ST leveraged its IPAD(TM) (Integrated
Passive and Active Devices) technology with new deep-attenuation EMI
filters and ESD protection devices dedicated to audio interfaces in slim
mobile equipment and accessories such as headsets. ST also introduced
integrated devices to protect Power-over-Ethernet (PoE and PoE+) power
source equipment in telecom and industrial applications, providing space
saving of 50% compared to standard solutions.
-- In power conversion ICs, ST announced the VIPerPlus family of off-line
SMPS (switched-mode power supply) converters, forming a broad family of
AC-DC converters that minimize both standby power consumption and the
number of external components required, while enabling easy compliance
with Blue Angel, Energy Star and other low-power standards and
directives. In addition, an ultra-high-efficiency power management IC
from ST was chosen for use by a major set-top-box maker for a
next-generation PVR.
-- In power MOSFETs, ST introduced a new family based on its SuperMESH(TM)
technology combining higher voltage capability, greater ruggedness, and
lower losses than previous devices. The family is suited for use in
high-efficiency power supplies for products such as LCD monitors,
televisions and energy-saving lamp ballasts. ST also gained its first
design-in for its MDmesh(TM) V MOSFET technology for a high-end
power-conversion application, along with a number of design wins in
computer power-management systems.
-- Also in power applications, ST gained important design wins for DC-DC
converters and voltage-regulator ICs from leading brands for a range of
applications including set-top boxes and netbooks. ST gained several
design wins in Bipolar, IGBT and RF power transistors, for applications
including mobile-phone power management from a leading handset maker,
with key OEMs in automotive, and also for several industrial
applications.
-- In advanced analog, ST achieved many design wins in mobile computing
applications, including a key win for its 'S-Touch' touch-sensor
controller IC with a world leader in PCs. Also in analog, ST gained
multiple design wins for its linear devices, in addition to launching
three new families of precision op-amps targeting low-power and portable
products with power-saving features, aimed at applications including
portable medical equipment, instrumentation and sensor interfaces.
ST-Ericsson Highlights
-- In May, ST-Ericsson announced a strategic partnership with China Mobile
to drive development of both high-end and low-cost handsets, based on 3G
standard TD-SCDMA. ST-Ericsson will also support four of its customers
to commercialize their mobile phones during 2009-2010.
-- In June, the company strengthened its partnership with Samsung by
providing an innovative platform for its first high-end TD-SCDMA/EDGE
device for China's mobile broadband market.
-- The company also announced mass production of its highly integrated RF
transceiver solution to reduce cost and system footprint in 3G handsets.
ST-Ericsson's Aero4228 solution eliminates the need for expensive
external filter components typically required to complete today's mobile
handset designs.
