TSMC Reports First Quarter EPS of NT$0.06

Capital Expenditures:

Capital expenditures for TSMC on a consolidated basis totaled US$166 million in 1Q09.

For year 2009, total capital expenditures for TSMC is expected to be around US$1.5 billion, compared with US$1.9 billion spent in 2008.



    V-2 . Capacity
                                 4Q08   1Q09   2Q09   3Q09   4Q09   2009
    Fab / (Wafer size)            (A)    (A)    (F)    (F)    (F)    (F)
    Fab-2        (6") Note 1      272    274    280    283    283  1,121
    Fab-3        (8")             274    286    289    292    283  1,150
    Fab-5        (8")             161    162    149    144    144    599
    Fab-6        (8")             282    295    284    287    287  1,154
    Fab-8        (8")             272    275    271    265    255  1,066
    Fab-12      (12") Note 2      221    218    219    218    254    909
    Fab-14      (12") Note 2      236    238    236    228    227    928
    WaferTech    (8")             106    106    107    109    109    431
    TSMC China   (8")             128    128    134    135    135    531
    TSMC total capacity
     (8" equiv. Kpcs)           2,405  2,431  2,414  2,394  2,455  9,695
    SSMC         (8")              73     64     65     65     65    259
    Total managed capacity
     (8" equiv. Kpcs)           2,478  2,495  2,479  2,460  2,520  9,954

    Note: 1. Figures represent number of 6" wafers.  Conversion to 8"-
             Equivalent wafers is obtained by dividing this number by 1.78
          2. Figures represent number of 12" wafers.  Conversion to 8"-
             equivalent wafers is obtained by multiplying this number by 2.25

Capacity:

Total managed capacity was 2,495K 8-inch equivalent wafers in the first quarter, increased by 0.7% from 2,478K in 4Q08.

Total managed capacity in 2009 is expected to reach 9,954K 8-inch equivalent wafers, representing an increase of 6% from 9,377K 8-inch equivalent wafers in 2008, while capacity for 12-inch wafer fabs is expected to increase by 11%, reaching 41.5% of total capacity.



    VI. Recap of Recent Important Events & Announcements

        -- TSMC Qualifies New 0.18-Micron Embedded Flash Family (2009/03/31)
        -- Ciranova and TSMC Announce Strategic Partnership on Advanced PDK
           Technology ( 2009/03/24)
        -- Barron's Names Dr. Rick Tsai to its Most Respected CEO List
           (2009/03/23)
        -- Intel, TSMC Reach Agreement to Collaborate on Technology Platform,
           IP Infrastructure, SoC Solutions (2009/03/02)
        -- TSMC and Tela Innovations Announce Strategic Partnership to Enhance
           Design and Process Co-Optimization  (2009/02/24)
        -- TSMC Board Proposes Dividend of NT$3.0 Cash and 0.5% Stock Per
           Share (2009/02/10)

    * Please visit TSMC's Web site ( 
www.tsmc.com ) for details about
  these and other announcements.



     TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED AND SUBSIDIARIES
                    Consolidated Condensed Balance Sheets

(Expressed in Millions of New Taiwan Dollars (NTD) and U.S. Dollars (USD))(1)

                                       March 31, 2009      December 31, 2008
                                         (unaudited)            (audited)
    ASSETS                           USD       NTD        %      NTD        %
    Current Assets
      Cash and Cash Equivalents    $6,583  $223,262    40.4  $194,614    34.8
      Investments in Marketable
       Financial Instruments          192     6,527     1.2    16,836     3.0
      Accounts Receivable -
       Trade, Net                     408    13,822     2.5    18,497     3.3
      Inventories, Net                436    14,775     2.7    14,877     2.7
      Other Current Assets            299    10,171     1.8     7,795     1.4
         Total Current Assets       7,918   268,557    48.6   252,619    45.2

    Long-Term Investments           1,052    35,682          6.5        39,982          7.2

        Property,  Plant  and  Equipment    25,568      867,199      156.9      862,461      154.3
        Less:  Accumulated
          Depreciation                                  (18,873)  (640,121)  (115.8)  (618,816)  (110.7)
                  Property,  Plant  and
                    Equipment,  Net                        6,695      227,078        41.1      243,645        43.6

        Other  Assets                                            633        21,458          3.8        22,671          4.0
        Total  Assets                                    $16,298    $552,775      100.0    $558,917      100.0

        LIABILITIES  AND  SHAREHOLDERS'
          EQUITY
        Current  Liabilities
            Accounts  Payable                              $172        $5,824          1.1        $6,043          1.1
            Payables  to  Contractors  and
              Equipment  Suppliers                        152          5,145          0.9          7,999          1.4
            Accrued  Expenses  and  Other
              Current  Liabilities                    1,006        34,120          6.1        34,543          6.2
            Current  Portion  of  Bonds
              Payable  and  Long-Term
              Liabilities                                            8              286          0.1          8,222          1.5
                  Total  Current  Liabilities    1,338        45,375          8.2        56,807        10.2
        Bonds  Payable                                          133          4,500          0.8          4,500          0.8
        Other  Long-Term  Liabilities              518        17,587          3.2        17,237          3.1
                  Total  Liabilities                    1,989        67,462        12.2        78,544        14.1

        Shareholders'  Equity
          Attributable  to  Shareholders
          of  the  Parent
            Capital  Stock  at  Par  Value        7,556      256,260        46.4      256,254        45.8
            Capital  Surplus                              1,473        49,965          9.0        49,875          8.9
            Legal  Capital  Reserve  (2)          1,985        67,324        12.2        67,324        12.0
            Special  Capital  Reserve  (2)            12              392          0.1              392          0.1
            Unappropriated  Earnings  (2)      3,063      103,896        18.8      102,338        18.3
            Treasury  Stock                                      --                --            --                --            --
            Others                                                    109          3,710          0.6              194          0.1
                  Total  Equity
                    Attributable  to
                    Shareholders  of  the
                    Parent                                      14,198      481,547        87.1      476,377        85.2
            Minority  Interests                            111          3,766          0.7          3,996          0.7
                  Total  Shareholders'
                    Equity                                      14,309      485,313        87.8      480,373        85.9
        Total  Liabilities  &
          Shareholders'  Equity                  $16,298    $552,775      100.0    $558,917      100.0



          TAIWAN  SEMICONDUCTOR  MANUFACTURING  COMPANY  LIMITED  AND  SUBSIDIARIES
                                        Consolidated  Condensed  Balance  Sheets 


« Previous Page 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8  Next Page »
Featured Video
Jobs
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
GPU Design Verification Engineer for AMD at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
Upcoming Events
Phil Kaufman Award Ceremony and Banquet to be held November 6 at Hayes Mansion at Hayes Mansion 200 Edenvale Ave San Jose CA - Nov 6, 2024
SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024
DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024
SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise