UMC Reports 2009 First Quarter Results

The percentage of revenue from the communication segment decreased to 57% of total revenue in 1Q09 due to decreasing demand for communication chips, especially in wireline products.

    Note 3: Revenue in this section represents wafer sales.


Blended Average Selling Price Trend

The blended average selling price (ASP) decreased by 10% in US dollar terms during 1Q09, due to a larger portion of the process technology mix coming from older process generations as well as short-term volume discounts to customers.


    (To view ASP trend, visit
http://www.umc.com/english/investors/1Q09_ASP_trend.asp )



    Shipment and Utilization Rate (Note 4)

                                            Wafer Shipments
                               1Q09     4Q08      3Q08      2Q08      1Q08
    Wafer Shipments
    ('000 8-inch eq.)           384      567       883       875       807

                                   Quarterly Capacity Utilization Rate
                               1Q09     4Q08     3Q08      2Q08      1Q08
    Utilization Rate            30%      48%      79%       85%       73%
    Total Capacity
    ('000 8-inch eq.)         1,151    1,151     1,149    1,107     1,100

Wafer shipments dropped 32.3% sequentially to 384 thousand, a decrease from 567 thousand 8-inch equivalent wafers in the previous quarter. Overall utilization rate for the quarter was 30%.

    Note 4: Utilization Rate = Quarterly Wafer Out / Quarterly Capacity


Capacity (5)

Capacity for 1Q09 was 1,151 thousand 8-inch equivalent wafers. The total capacity remained the same as from Q408. The total estimated installed capacity in 2Q09 also remains unchanged, although 65nm capacity is increasing due to internal capacity conversion and 8-inch wafer capacity moving to more advanced nodes.



    Annual Capacity in
    thousands of 8-inch wafer equivalents

                FAB       Geometry       2008     2007     2006     2005
                            (um)
    Fab 6A       6"       3.5 - 0.45      328      328      328      344
    Fab 8A       8"       0.5 - 0.25      816      816      816      816
    Fab 8C       8"      0.35 - 0.15      417      400      400      401
    Fab 8D       8"      0.18 - 0.09      257      260      252      274
    Fab 8E       8"       0.5 - 0.18      408      408      406      404
    Fab 8F       8"      0.25 - 0.15      372      372      372      378
    Fab 8S (1)   8"      0.25 - 0.15      291      276      276      278
    Fab 12A      12"     0.18 - 0.065     876      847      754      597
    Fab 12i (2)  12"     0.13 - 0.065     742      601      413      363
    Total (3)                           4,507    4,308    4,017    3,855
    YoY Growth Rate                        5%       7%       4%      22%


    Quarterly Capacity in
    thousands of 8-inch wafer equivalents

    FAB                   2Q09E     1Q09     4Q08     3Q08
    Fab 6A                   82       82       82       82
    Fab 8A                  204      204      204      204
    Fab 8C                  102      105      108      108
    Fab 8D                   66       66       63       63
    Fab 8E                  102      102      102      102
    Fab 8F                   96       93       93       93
    Fab 8S                   75       75       75       75
        Fab  12A                                  222            222            222            220
        Fab  12i                                  202            202            202            202
        Total  (3)                          1,151        1,151        1,151        1,149

        (1)  Former  fab  of  SiSMC,  which  was  acquired  from  Silicon  Integrated
                Systems  in  July  2004.
        (2)  Former  fab  of  UMCi,  a  UMC  wholly  owned  subsidiary  in  December  2004
                that  was  merged  into  UMC  in  April  2005
        (3)  One  6-inch  wafer  is  converted  into  0.5625(6sq/8sq)  8-inch  equivalent
                wafer;  one  12-inch  wafer  is  converted  into  2.25(12sq/8sq)  8-inch
                equivalent  wafers.
 


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