TSMC Reports Second Quarter EPS of NT$1.12

Debt Service:

Net cash reserves -- defined as the excess of cash and short-term marketable securities over interest-bearing debt -- increased by NT$13.7 billion to NT$201.1 billion at the end of 2Q08.



    III -- 3. Debt Service
     (In NT billions)                 2Q08       1Q08       2Q07

    Cash & Marketable Securities     224.0      210.3      233.1
    Interest-Bearing Debt             22.9       22.9       26.3
    Net Cash Reserves                201.1      187.4      206.8



    Cash Flow

Summary of Cash Flow:

Cash generated from operating activities totaled NT$45.0 billion during the quarter, down from NT$57.3 billion in 1Q08, mainly due to tax payment of NT$10.0 billion and inventory increase of NT$1.5 billion.

Net cash generated in investing activities was NT$3.6 billion in 2Q08, reflecting capital expenditure of NT$22.3 billion and a net increase of NT$27.2 billion in marketable financial instruments.

Net cash used in financing activities was NT$6.8 billion during the quarter, as we spent NT$6.6 billion in share buyback.

As a result, TSMC ended the quarter with a cash balance of NT$185.3 billion.



      IV -- 1. Cash Flow Analysis

      (In NT billions)                       2Q08      1Q08      2Q07

      Net Income                             28.8      28.1      25.5
      Depreciation & Amortization            20.0      19.8      19.6
      Other Operating Sources/(Uses)         (3.8)      9.4     (10.4)
      Total Operating Sources/(Uses)         45.0      57.3      34.7
      Capital Expenditure                   (22.3)    (15.3)    (25.3)
      Marketable Financial Instruments       27.2      12.9      15.8
      Other Investing Sources/(Uses)         (1.3)     (0.7)     (0.7)
      Net Investing Sources/(Uses)            3.6      (3.1)    (10.2)

      Purchase of Treasury Stock             (6.6)     (3.1)      0.0
      Other Financing Sources/(Uses)         (0.2)     (0.2)     (0.5)
      Net Financing Sources/(Uses)           (6.8)     (3.3)     (0.5)
      Net Cash Position Changes              41.8      50.9      24.0
      Exchange Rate Changes & Others         (0.8)     (1.6)     (0.9)
      Ending Cash Balance                   185.3     144.3     163.4


Operating and Free Cash Flows:

Cash flows generated from operating activities were NT$45.0 billion during the quarter. Free cash flow, defined as the excess of operating cash flows over capital expenditures, totaled NT$22.8 billion in 2Q08, compared to NT$42.0 billion in 1Q08.

    Please refer to the link for the index charts:
    http://www.tsmc.com/uploadfile/ir/quarterly/index_charts.pdf

    V. CapEx & Capacity

Capital Expenditures:

Capital expenditures for TSMC on a consolidated basis totaled US$728 million during the quarter.

In the first half of 2008, total capital expenditure reached US$1.2 billion.



    V -- 1. Capital Expenditures

    (In US millions)                   1Q08      2Q08       YTD

    TSMC                                452       712      1,164
    XinTec and GUC                       13         5         18
    TSMC Shanghai & WaferTech            18        11         29
    Other TSMC Subsidiaries               1         0          1
    Total TSMC                          484       728      1,212


Capacity:

Total TSMC managed capacity was 2,303K 8-inch equivalent wafers in the second quarter, 6% more than 1Q08. TSMC managed capacity in 3Q08 will increase by 5% to reach 2,416K 8-inch equivalent wafers.

Total managed capacity for 2008 is expected to reach 9,377K 8-inch equivalent wafers, representing an increase of 13% from 8,290K 8-inch equivalent wafers in 2007, while capacity for 12-inch wafer fabs will increase by 27%.



    V--2. Capacity
                                     1Q08    2Q08    3Q08    4Q08    2008
    Fab / (Wafer size)                (A)     (A)     (F)     (F)     (F)

    Fab-2              (6")(Note 1)   248     267     270     272   1,056
    Fab-3              (8")           277      281          268          274      1,100
        Fab-5                            (8")                      163          165          161          161          650
        Fab-6                            (8")                      265          267          268          282      1,082
        Fab-8                            (8")                      262          275          267          272      1,076
        Fab-12                        (12")(Note  2)      197          207          214          221          840
        Fab-14                        (12")(Note  2)      167          185          229          236          818
        WaferTech                    (8")                      105          105          106          106          420
        TSMC  (Shanghai)        (8")                        88          110          128          128          453
        TSMC  total  capacity
          (8  equiv.  Kpcs)                                2,117      2,236      2,346      2,405      9,104
        SSMC                              (8")                        63            67            69            73          272
        Total  managed  capacity
          (8  equiv.  Kpcs)                                2,180      2,303      2,416      2,478      9,377

        Note:  1.  Figures  represent  number  of  6  wafers.    Conversion  to  8-
                          Equivalent  wafers  is  obtained  by  dividing  this  number  by  1.78
                    2.  Figures  represent  number  of  12  wafers.    Conversion  to  8-
                          equivalent  wafers  is  obtained  by  multiplying  this  number  by
                          2.25



        VI.  Recap  of  Recent  Important  Events  &  Announcements

        --  TSMC  Wins  Corporate  Governance  Asia  Annual  Recognition  Award  2008
              (2008/06/26)
        --  TSMC  Shareholders  Approve  NT$3.0  Cash  and  0.5%  Stock  Dividend
              (2008/06/13)
        --  TSMC  Unified  DFM  Architecture  Promises  Improved  Yields  and
              Accelerated  Time-to-Market  (2008/06/09)
        --  New  TSMC  Reference  Flow  9.0  Supports  40nm  Process  Technology
              (2008/06/03)
        --  TSMC  Board  Approves  Plan  to  Buy  Back  and  Cancel  Shares  up  to  US$1
              billion  (2008/05/13)
        --  TSMC  Board  Approves  Capital  Appropriation  of  US$995  Million  to
              Expand  Fab  12  and  Increase  Its  Advanced  Process  Capacity  (2008/05/13)
        --  Intel,  Samsung  Electronics,  TSMC  Reach  Agreement  For  450mm  Wafer
              Manufacturing  Transition  (2008/05/06)
        --  TSMC  Unveils  New  40/65-Nanometer  SPICE  Tool  Qualification  Program
            (2008/04/22)
        --  TSMC  and  NTHU  Celebrate  Opening  of  College  of  Technology  Management
              TSMC  Building  (2008/04/18)
        --  TSMC  Announces  Power  Trim  Service  for  Advanced  Chip  Leakage  Power
              Reduction  (2008/04/15)
 


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