In typical applications, the MOSFETs are used in tandem to amplify, to the nominal power level needed for driving the transmission antenna and audio signals that have converted to the high frequencies of the wireless network. They are suitable for frequencies in the 175MHz and 500MHz bands for commercial wireless systems, and in the 800MHz and 900MHz bands for cell phones.
Compared to previous-generation power MOSFETs, the RQA0010 and RQA0014 have the greater efficiency and higher output at low-voltage operation that are essential for decreasing power consumption and thus extending battery life in portable wireless products. By using with a new fabrication process, Renesas has achieved a 60 percent power-added efficiency (PAE) in the RQA0010 MOSFET at 3.6V, and a 55 percent PAE in the RQA0014 MOSFET at the same supply voltage. As a result, a two-stage amplifier that uses an RQA0010 to boost the output of an RQA0014, achieves the industry's highest level of performance: a 1.2W output at 3.6V.
The high-frequency power MOSFETs have been subjected to ESD immunity testing that simulates the electrostatic discharges that could occur in actual use from a person or metal object, as required by the IEC61000-4-2 standard. The transistors have an internal structure that provides maximum protection in the areas of the chip where damage typically occurs. Careful design and fabrication have resulted in successful ESD immunity level 4 (14kV) testing, verifying MOSFET performance that promotes high reliability in wireless products, where contact with human bodies is a basic aspect of normal operation.
The package used for the RQA0010 and RQA0014 MOSFETs is the proven Renesas UPAK (Renesas package code) miniature package that measures only 4.5 × 2.5 × 1.5mm (max). It facilitates miniaturization and thinner form factors in compact handheld wireless products. The UPAK is a source-flange type package that combines electrical grounding with high thermal dissipation. It’s also environmentally friendly, being completely lead-free.
Price and Availability
| Product Name |
Package (Renesas package code) |
Sample Price/Availability |
||
| RQA0010 | UPAK | $0.30/Q3 2008 | ||
| RQA0014 | UPAK | $0.19/Q3 2008 |
About Renesas Technology Corp.
Renesas Technology Corp. is one of the world's leading semiconductor
system solutions providers for mobile, automotive and PC/AV (Audio
Visual) markets and the world's No.1 supplier of microcontrollers. It is
also a leading provider of LCD Driver ICs, Smart Card microcontrollers,
RF-ICs, High Power Amplifiers, Mixed Signal ICs, System-on-Chip (SoC),
System-in-Package (SiP) and more. Established in 2003 as a joint venture
between Hitachi, Ltd. (TOKYO:6501)(NYSE:HIT) and Mitsubishi Electric
Corporation (TOKYO:6503), Renesas Technology achieved consolidated
revenue of 951billion JPY in FY2007 (end of March 2008). Renesas
Technology is based in Tokyo, Japan and has a global network of
manufacturing, design and sales operations in 17 countries with 26,800
employees worldwide. For further information, please visit
http://www.renesas.com
