Ralink Announces 802.11n WLAN for DOCSIS(R) 3.0 Gateway Reference Design With Texas Instruments' Puma 5 at the 2008 Cable Show

NEW ORLEANS—(BUSINESS WIRE)—May 19, 2008— Ralink, a leading developer of 802.11x chips, today announced that its Wi-Fi 802.11n solution - RT2880 iNIC now supports Texas Instruments Puma 5 family of DOCSIS® 3.0-based (Data Over Cable Service Interface Specification) cable modem chipsets. TIs Puma 5 family is the industrys first DOCSIS 3.0 compliant cable modem chipset providing a flexible and scalable platform that enables equipment manufacturers to meet the market demand for innovative next-generation voice, data and video solutions combined with advanced networking capabilities.

This is Ralinks first 802.11n enabled gateway platform for high speed DOCSIS 3.0 data and video applications. Cable equipment vendors deploying the new platform will be able to introduce cutting-edge wireless networking technology in the shortest time possible. Multi Service Operators (MSOs) and Cable operators will be able to fully leverage their access network capacity to deliver media-rich services and content to todays networked user.

Ralink is leveraging TIs proven Puma 5 DOCSIS 3.0 compliant products to enable cable manufacturers and MSOs to deliver an 802.11n home networking solution that meets the growing demand for networked multimedia broadcast solutions, said Ran Senderovitz, TIs cable business manager. The Puma 5 familys flexible architecture allows partners such as Ralink to build on top of our proven DOCSIS 3.0 products leading to the creation of a wide variety of next generation voice, data and video solutions.

RT2880 iNIC is a System On Chip (SoC) that integrates Ralinks 802.11n 300 Mbps 2T3R (two transmit, three receive) Baseband and Media Access Control (MAC) chips with a MIPS4K CPU. The RT2880 supports the latest 802.11i security features including Wi-Fi Protected Setup, 802.11e Quality of Service (QoS) features including WMM and WMM-PS for prioritization of voice, video and data. It also supports both the 5GHz and 2.4GHz bands when used with Ralinks transceivers RT2850 and RT2820, respectively.

We are very happy to work closely with TI to enable customers to distribute the enhanced bandwidth and services offered by DOCSIS 3.0 with strong 802.11n capabilities poised for applications like triple play and IP service providers, said Kenny Chiu, Vice President of Worldwide Business Development at Ralink Technology. RT2880 helps maximize users experience by distributing sustained multimedia streams at far reach in the home or office in the presence of intereference and supporting the latest 802.11i security features including WiFi Protected Setup.

For more information about TIs Puma 5 family of DOCSIS 3.0 products, please visit: www.ti.com/corp/docs/landing/puma5.

About Ralink tradename of their WLAN solution

The consumers appetite for wireless bandwidth is growing and 802.11n is meeting that demand by providing wireless connectivity with PHY rates up to 300 Mbps and actual data throughput of up to 170 Mbps. However, many current wireless routers, Cable/DSL modems, and set top boxes lack the CPU power to support 802.11ns high throughput capabilities. Enter RT2880s unique chipset solution, which features iNIC architecture that connects to a host processors PCI/Ethernet interface and handles all of the 802.11n processing. The host CPU only needs to run a simple Ethernet-like driver, which saves precious processing power for value added applications.

About Ralink

Ralink Technology Corporation is a leading innovator and developer of wireless LAN chipset solutions. Ralink 802.11x chipsets are recognized for superior throughput, extended range, low-power consumption and consistent reliability demanded by Wi-Fi, mobile and embedded applications. These feature-rich chipsets have a high level of chip integration for client and AP solutions for CB, miniPCI, PCI, PCIe and USB interfaces, enabling customers to build smaller and more sophisticated mobile wireless products cost-effectively. Ralinks patented MIMObility technology extends Wi-Fi applications from traditional PC networking to a range of digital multimedia and handheld devices including cell phones, PDAs, cameras, print servers, HDTV and video game players. Ralink customers can look forward to continuous improvements in speed, bandwidth and reliability with 802.11n solutions for next-generation high-performance Wi-Fi. Ralink Technology was founded in 2001 with headquarters in Hsinchu, Taiwan and an R&D center in Cupertino, California. For more information, visit Ralink at www.ralinktech.com or send email to Email Contact.

Cautionary Statement Concerning Forward-looking Statements

This document may contain certain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These statements are based on managements views and assumptions regarding future events and business performance as of the time the statements are made. Actual results may differ materially from these expectations due to changes in global economic, business, competitive market, regulatory and other factors. More detailed information about these and other factors that could affect future results is contained in our filings with the US Securities and Exchange Commission. Any forward-looking statements included in this document are made only as of the date of this document and we do not have any obligation, nor do we undertake, to publicly update any forward-looking statements to reflect subsequent events or circumstances, except as required by law.

1 | 2  Next Page »
Featured Video
Jobs
Sr. Silicon Design Engineer for AMD at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
GPU Design Verification Engineer for AMD at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
Upcoming Events
Phil Kaufman Award Ceremony and Banquet to be held November 6 at Hayes Mansion at Hayes Mansion 200 Edenvale Ave San Jose CA - Nov 6, 2024
SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024
DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024
SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise