Ventec Promotes Bill Wang to Group Technical Vice President
[ Back ]   [ More News ]   [ Home ]
Ventec Promotes Bill Wang to Group Technical Vice President

Ventec Promotes Bill Wang to Group Technical Vice President 

 

October 14, 2024 – Ventec International Group, a Taiwan Stock Exchange listed (TWSE:6672.TT) global supplier of advanced base materials for the PCB industry worldwide, has promoted Bill Wang to Group Technical Vice President. 

Having served as Ventec’s Technical Director since 2013, Bill now adds responsibility for the group’s overseas business units to his remit, leveraging the company’s wide-ranging expertise to create solutions in sectors such as high-performance computing, cloud servers, communications and networking, cellular infrastructure, consumer products, and solid-state lighting. He will continue to lead the Technical Department at the company’s global headquarters, while also directing the Global OEM Technology and IMS Technology sections in the EMEA and Americas regions.

Welcoming him in his new role, Jason Chung, Ventec International Group CEO, said, “Bill’s energy has driven our technical department to ever-greater achievements and our current pre-eminent position in substrate materials that deliver cutting-edge performance. He richly deserves the extra faith we are placing in him, and I have every confidence he will continue to expand our capabilities and strengthen our leading position.”

Bill commented, “Ventec’s technical prowess, alongside our supply-chain capabilities and global customer support services, are key differentiators for our business. I am excited to be working with our global teams to build our strength and continue extending our advantage.”

Ventec’s product portfolio encompasses signal integrity/high-speed digital, RF/Analog & high-performance IMS material technology, and an advanced range of thermal management solutions designed for specialized use in industries including automotive, communication, aerospace, and defense. The comprehensive product line includes pro-bond and thermal-bond resin-coated films for signal-integrity applications, flex/flex-rigid and thin-flex products, and materials for special applications. The group also provides value added technical services, lab capabilities, and capital equipment for PCB fabrication.

Further information about Ventec’s solutions and the company’s wide variety of products is available at   www.venteclaminates.com.

Image Source: Ventec International Group
Bill Wang promoted to Ventec Group Technical Vice President

About Ventec International Group

Ventec International Group Co., Ltd. is a Taiwan Stock Exchange listed (TWSE:6672.TT) global supplier of advanced base materials for the PCB industry worldwide. Ventec’s range of laminates & prepregs include signal integrity/high-speed digital, RF/Analog & high-performance IMS material technology, and an advanced range of thermal management solutions designed for specialized use in industries including automotive, communication, aerospace, and defense. Ventec also provides value-added one-stop shop services to support PCB manufacturing and distributes a range of third-party materials and automated production equipment that complement its core product offering. Operating its own fully controlled and managed global supply chain and worldwide sales and technical support network, Ventec has manufacturing, and distribution facilities located throughout Asia, Europe, and the US, certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015.
For more information, visit www.venteclaminates.com


Safe Harbor Statement

This press release contains projections and other forward-looking statements regarding future events or our future financial performance. All statements other than present and historical facts and conditions contained in this release, including any statements regarding our future results of operations and financial positions, business strategy, plans and our objectives for future operations, are forward-looking statements. These statements are only predictions and reflect our current beliefs and expectations with respect to future events and are based on assumptions and subject to risk and uncertainties and subject to change at any time. We operate in a very competitive and rapidly changing environment. New risks emerge from time to time. Given these risks and uncertainties, you should not place undue reliance on these forward-looking statements. Actual events or results may differ materially from those contained in the projections or forward-looking statements. Some of the factors that could cause actual results to differ materially from the forward-looking statements contained herein include, without limitation: (i) the contraction or lack of growth of markets in which we compete and in which our products are sold (ii) unexpected increases in our expenses, including manufacturing expenses, (iii) our inability to adjust spending quickly enough to offset any unexpected revenue shortfall, (iv) delays or cancellations in spending by our customers, (v) unexpected average selling price reductions, (vi) the significant fluctuation to which our quarterly revenue and operating results are subject, (vii) our inability to anticipate the future market demands and future needs of our customers, (viii) our inability to achieve new customer wins or for customer wins to result in shipments of our products at levels and in the timeframes we currently expect, (ix) our inability to execute on strategic alliances, (x) the impact of natural disasters on our sourcing operations and supply chain, and (xi) other factors detailed in documents we file from time to time with the Securities and Exchange Commission.


Media Contact

Kim Sauer (Mr)
Global Marketing Communications
Ventec International Group

Email:  Email Contact
Mobile: +44 7906 019 022
www.venteclaminates.com