DALLAS, TX (AUGUST 16, 2024) – The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a Call for Papers for ECTC 2025, the conference’s 75th anniversary.
The 75th annual ECTC will take place May 27-30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas. More than 2,000 scientists, engineers and business people from more than 20 countries are expected to attend.
ECTC announces that abstract submission will open on August 26, and the deadline for submissions is October 7, 2024. To submit an abstract, visit www.ectc.net.
The ECTC 2025 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies in electronics packaging.
Previously unpublished, non-commercial paper abstracts are requested in areas including:
- Applied Reliability
- Assembly and Manufacturing Technology
- Electrical Design and Analysis
- Emerging Technologies
- RF, High-Speed Components & Systems
- Interconnections
- Materials & Processing
- Thermal/Mechanical Simulation & Characterization
- Packaging Technologies
- Photonics
- Interactive Presentations
For all details including the major topics and other important information, please refer to: https://www.ectc.net/abstracts/75thCallforPapers-Web.pdf
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About IEEE & EPS
IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice on a wide variety of areas ranging from aerospace systems, computers and telecommunications, to biomedical engineering, electric power, and consumer electronics.
The IEEE’s Electronics Packaging Society (EPS) sponsors the ECTC conference. EPS is the leading international forum for scientists and engineers engaged in research, design and development of revolutionary advances in microsystems packaging and manufacturing. Its areas of interest encompass all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components.