Ansys Announces Q1 Financial Results

TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips

Ansys and TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

Ansys Releases AI-Powered Virtual Assistant AnsysGPT

Ansys Joins BAE Systems' Mission Advantage Program to Advance Digital Engineering Across US Department of Defense

Ansys Forms OEM Partnership with SynMatrix to Accelerate RF Filter Design

Craig Shirley, CEO Oski Technology

Paul Cunningham, Senior vice president, System and Verification Group Cadence

Raza Khan, Senior Marketing Manager Semtech Tri-Edge

EDACafe Editorial by Roberto Frazzoli 40 Gbps UCIe IP; 300-mm GaN wafers; new edge AI SoCs; new US export controls

Bridging the Frontier by Bob Smith, Executive Director The Phil Kaufman Award Ceremony and Banquet Coming in November to Hayes Mansion

Siemens EDA by Lee Wang Chip-level thermal analysis solves a main barrier to 3DICs

Industry Predictions by Sanjay Gangal Rambus Introduces DDR5 Client Clock Driver, Paving the Way for High-Performance Laptops and Desktops

EDACafe Editorial by Sanjay Gangal Accelerating AI-Driven Cloud Optimization: Inside Arm’s Partnership with Exostellar

Design Verification Engineer for Blockwork IT at Milpitas, California

CAD Engineer for Nvidia at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

MEMS & Sensors Executive Congress (MSEC 2024) at Château-Bromont Hotel in Bromont Quebec Canada - Oct 7 - 9, 2024

PCB West 2024 at Santa Clara Convention Center Santa Clara CA - Oct 8 - 11, 2024

DVcon Europe 2024 at Holiday Inn Munich City Center, Munich Germany - Oct 15 - 16, 2024

International Test Conference (ITC) at United States - Nov 3 - 8, 2024