Latest Advancements in Safety and Reliability Requirements in Medical, Auto and Aerospace Applications Take Center Stage at IPC’s High Reliability Forum
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Latest Advancements in Safety and Reliability Requirements in Medical, Auto and Aerospace Applications Take Center Stage at IPC’s High Reliability Forum

The critical reliability of electronic prosthetics in the brain to help restore movement to a paralyzed hand, enhancing the durability of EV automotive infrastructure, testing criteria and challenges of working with lead-free materials, and evaluation of reliability and maintainability for safe airborne structures are just a few of the agenda items offered at IPC’s High Reliability Forum October 17-19 in Linthicum (Baltimore), Md.

Presentation topics include: safety critical electronics considerations; military, aerospace, medical, automotive, e-Mobility and other applications with specialized reliability requirements; and others related to high reliability issues in PCB design, PCB fabrication materials, PCB assembly, PCBA surface reliability, emerging electronic technologies, mitigation strategies and test methods.

Speakers from the following companies include: Ed Reynolds, John Hopkins University Applied Physics Laboratory (opening keynote); Cynthia A. Chestek, Ph.D., University of Michigan; Raymond Zhao, Ph.D., Northrop Grumman Systems Corporation; Leslie Kim, MacDermid Alpha Electronics Solutions; Brian O’Leary, Indium Corporation; Theresa Campobasso, Exiger; William Capen, Honeywell; and Denis Barbini, Ph.D., Zestron. View complete speaker lineup.

“The event provides a unique opportunity for those in industry who design, manufacture, or test electronics for critical applications with unique safety, reliability, and lifetime requirements to learn about the latest advancements, participate in industry discussions, and network with a respected community of professionals who are all focused on high reliability electronics,” said Bhanu Sood Ph.D., NASA Goddard Space Flight Center, and High Reliability Forum Technical Program co-chair. “And this year, the technical panel is stronger than ever, with well-rounded, industry-curated content focused on electronics with high reliability requirements.”

For more information on the IPC High Reliability Forum including agenda, speaker profiles, exhibition and sponsorship information, or to register for event, visit www.ipc.org/event/high-reliability-forum.