"FLEX will showcase advancements in next-generation electronics packaging accelerating industry growth," said Melissa Grupen-Shemansky, CTO and Vice President of Technology Communities at SEMI. "Companies pushing the boundaries of heterogeneous integration will join FlexTech, NBMC and NextFlex innovators as they present cutting-edge research and development to advance industry technical knowledge through papers, posters, and product information."

Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2023.

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About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit  www.semi.org, contact one of our worldwide offices, and connect with SEMI on  LinkedIn and  Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email:  Email Contact

SOURCE SEMI