AMD Expands Leadership Data Center Portfolio with New EPYC CPUs and Shares Details on Next-Generation AMD Instinct Accelerator and Software Enablement for Generative AI

AMD, the AMD Arrow logo, EPYC, AMD Instinct, ROCm, Ryzen, Radeon and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

CAUTIONARY STATEMENT

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including, the AMD 4th Gen EPYC™ processor family, the AMD Instinct™ MI300 Series accelerator family, including AMD Instinct™ MI300X and AMD Instinct™ MI300A, and the AMD Pensando DPU codenamed “Giglio”, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; global economic uncertainty; cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; loss of a significant customer; impact of the COVID-19 pandemic on AMD’s business, financial condition and results of operations; competitive markets in which AMD’s products are sold; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to introduce products on a timely basis with expected features and performance levels; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyber-attacks; potential difficulties in upgrading and operating AMD’s new enterprise resource planning system; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products in a timely manner; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; impact of government actions and regulations such as export administration regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals-related provisions and other laws or regulations; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses;  impact of any impairment of the combined company’s assets on the combined company’s financial position and results of operation; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit facility; AMD's indebtedness; AMD's ability to generate sufficient cash to meet its working capital requirements or generate sufficient revenue and operating cash flow to make all of its planned R&D or strategic investments; political, legal, economic risks and natural disasters; future impairments of goodwill and technology license purchases; AMD’s ability to attract and retain qualified personnel; AMD’s stock price volatility; and worldwide political conditions. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

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1 EPYC-049: AMD EPYC 9754 is a 128 core dual threaded CPU and in a 2 socket server with 1 thread per vCPU delivers 512 vCPUs per EPYC powered server which is more than any Ampere or 4 socket Intel CPU based server as of 05/23/2023.
2 SP5-143A: SPECrate®2017_int_base comparison based on performing system published scores from www.spec.org as of 6/13/2013. 2P AMD EPYC 9754 scores 1950 SPECrate®2017_int_base www.spec.org/cpu2017/results/res2023q2/cpu2017-20230522-36617.html is higher than all other 2P servers. 1P AMD EPYC 9754 scores 981 SPECrate®2017_int_base score (981.4 score/socket) www.spec.org/cpu2017/results/res2023q2/cpu2017-20230522-36613.html is higher per socket than all other servers. SPEC®, SPEC CPU®, and SPECrate® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.
3 SP5-165: The EPYC 9684X CPU is the world’s highest performance x86 server CPU for technical computing, comparison based on SPEC.org publications as of 6/13/2023 measuring the score, rating or jobs/day for each of SPECrate®2017_fp_base (SP5-009E), Altair AcuSolve (https://www.amd.com/en/processors/server-tech-docs/amd-epyc-9004x-pb-altair-acusolve.pdf), Ansys Fluent (https://www.amd.com/en/processors/server-tech-docs/amd-epyc-9004x-pb-ansys-fluent.pdf), OpenFOAM (https://www.amd.com/en/processors/server-tech-docs/amd-epyc-9004x-pb-openfoam.pdf), Ansys LS-Dyna (https://www.amd.com/en/processors/server-tech-docs/amd-epyc-9004x-pb-ansys-ls-dyna.pdf), and Altair Radioss (https://www.amd.com/en/processors/server-tech-docs/amd-epyc-9004x-pb-altair-radioss.pdf) application test case simulations average speedup on 2P servers running 96-core EPYC 9684X vs top 2P performance general-purpose 56-core Intel Xeon Platinum 8480+ or top-of-stack 60-core Xeon 8490H based server for technical computing performance leadership. “Technical Computing” or “Technical Computing Workloads” as defined by AMD can include: electronic design automation, computational fluid dynamics, finite element analysis, seismic tomography, weather forecasting, quantum mechanics, climate research, molecular modeling, or similar workloads. Results may vary based on factors including silicon version, hardware and software configuration and driver versions. SPEC®, SPECrate® and SPEC CPU® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.
4 MI300-09 - The AMD Instinct™ MI300X accelerator is based on AMD CDNA™ 3 5nm FinFet process technology with 3D chiplet stacking, utilizes high speed AMD Infinity Fabric technology, has 192 GB HBM3 memory capacity (vs. 80GB for Nvidia Hopper H100) with 5.218 TFLOPS of sustained peak memory bandwidth performance, higher than the highest bandwidth Nvidia Hopper H100 GPU.
5 MI300-07K: Measurements by internal AMD Performance Labs as of June 2, 2023 on current specifications and/or internal engineering calculations. Large Language Model (LLM) run or calculated with FP16 precision to determine the minimum number of GPUs needed to run the Falcon (40B parameter) models. Tested result configurations: AMD Lab system consisting of 1x EPYC 9654 (96-core) CPU with 1x AMD Instinct™ MI300X (192GB HBM3, OAM Module) 750W accelerator tested at FP16 precision. Server manufacturers may vary configuration offerings yielding different results.


Contact:
Aaron Grabein
AMD Communications
(512) 602-8950
Aaron.grabein@amd.com

Suresh Bhaskaran
AMD Investor Relations
(408) 749-2845
Suresh.Bhaskaran@amd.com

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