SEMICON Southeast Asia 2023 Opens with Chip Industry Resilience and Growth in Focus
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SEMICON Southeast Asia 2023 Opens with Chip Industry Resilience and Growth in Focus

PENANG, Malaysia — 22 May 2023 — SEMICON Southeast Asia, the region’s premier event for the global electronics manufacturing and design supply chain, opens tomorrow with critical semiconductor industry topics including supply chain resilience, sustainability, Smart Manufacturing, Smart Mobility, Smart MedTech, and workforce development in focus. Themed Boosting Agility and Resiliency for the Electronics Supply Chain, the May 23-25 exhibition and conferences at the Setia SPICE Convention Centre and Arena in Penang are expected to draw nearly 300 exhibitors and more than 10,000 attendees. 

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SEMICON Southeast Asia 2023 will gather experts and visionaries for insights into the latest semiconductor industry developments, trends and innovations. With the industry’s sights set on reaching $1 trillion in revenue by 2030, the event will also bring together chip manufacturing and equipment companies, private and public partners, and other key industry stakeholders to explore new collaboration and growth opportunities.

Semiconductor Industry Agility and Resiliency

The CxO Summit at SEMICON Southeast Asia 2023 will convene industry thought leaders to discuss modernizing supply chain strategies in response to ongoing industry disruptions and geopolitical instability. Focusing on building a more agile and resilient semiconductor industry supply chain, the summit will feature the following speakers:

Speakers will also participate in the panel discussion Boosting Agility and Resiliency of the Electronics Supply Chain in Southeast Asia to culminate the CxO Summit. The panel will include Tan Yew Kong, Senior Vice President and General Manager, GlobalFoundries.

Other SEMICON Southeast Asia 2023 Highlights

Visit the SEMICON Southeast Asia 2023 website for more information.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit
www.semi.org, contact one of our worldwide offices, and connect with SEMI on  LinkedIn and  Twitter to learn more.

Media Contacts

Ryan Teo/SEMI Southeast Asia
Phone: +65 9859 0883
Email:
rteo@semi.org

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email:  mhall@semi.org

Reshvinder Kaur/Din Communications
Phone: +6017 275 7985
Email:
resh@dincommunications.com / reshvinder.kaur@gmail.com