Chiplets Help Designers Reduce Time-to-Market
SAN DIEGO — (BUSINESS WIRE) — January 12, 2023 — Chiplet Summit, to be held January 24-26 at the DoubleTree by Hilton San Jose Hotel, will help designers go-to-market faster by using the latest design architecture – chiplets. All the leading semiconductor companies are now using them to speed up design at leading-edge process nodes. The Summit will help designers with the new stage of heterogeneous integration and the new requirement of implementing a die-to-die interface. It will also help them divide up designs properly, add design-for-test and design-for-manufacturing features, and implement both chiplet-level and package-level debug and test. Furthermore, it will offer insight into chiplet markets, packaging, and data management.
The event covers the latest architectures, development methods, and applications. Expert panels will discuss best choices, likely breakthroughs, and long-term trends. Industry-leading keynotes give designers essential information about trends and roadmaps. Speakers represent Intel, Applied Materials, Corigine, proteanTecs, Silicon Catalyst (discussing the $60B US CHIPS Act), and Open Compute Project (OCP).
“Chiplet Summit focuses on bringing the entire chiplet ecosystem together, including designers, packagers, testers, and specialists in integration, interfaces, security, power, and thermals. They must work together throughout the development process to produce successful chips that foundries can manufacture at low cost,” said Chuck Sobey, Summit General Chair.
Supporting Resources -
- Visit Chiplet Summit: ChipletSummit.com
- Follow Chiplet Summit on LinkedIn.com/groups/4129499
- Follow Chiplet Summit on Twitter.com/ChipletSummit
- Follow Chiplet Summit on Facebook.com/ChipletSummit
To obtain a free press registration, contact:
Elizabeth Leventhal, Operations Director
Elizabeth@ChipletSummit.com
+1.760.809.5755
To ask about the program, contact:
Lance Leventhal, Program Chairperson
Lance@ChipletSummit.com
+1.858.756.3327
About Chiplet Summit
Chiplet Summit, produced by Semper Technologies, showcases the mainstream applications, key technologies, and leading vendors that are driving the rapidly expanding chiplet market. It is the first event featuring the trends, innovations, and influencers driving the adoption of chiplets in demanding processor, coprocessor, memory, communications, and AI/ML applications.
To learn more about the Summit, please visit https://chipletsummit.com/.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230112005737/en/
Contact:
Media and Press Registration Contact:
Elizabeth Leventhal
+1.760.809.5755
Press@ChipletSummit.com