7-Channel DMOS Transistor Array from Diodes Incorporated Drives Inductive Loads While Dissipating Minimal Power

Winbond's LPDDR4/4X 100BGA achieves JEDEC standard for improved energy conservation and carbon reduction in a smaller package size

Silicon Labs Grows Revenue 55% in Second Quarter 2022

UMC Reports Second Quarter 2022 Results

Teledyne Technologies Reports Second Quarter Results

TI reports second quarter 2022 financial results and shareholder returns

Hans Bouwmeester, CEO PrimisAI

Simon Rance, Director of Product Management and Strategic Marketing Keysight Technologies

Jeff Wilson, Director Siemens EDA

EDACafe Editorial by Roberto Frazzoli TSMC-EDA updates; Google’s AI-based chip layout tool; new Altera FPGAs; double-faced GaN wafers

Bridging the Frontier by Bob Smith, Executive Director Wojciech P. Maly Inducted into the Phil Kaufman Hall of Fame

Siemens EDA by Lee Wang Chip-level thermal analysis solves a main barrier to 3DICs

Industry Predictions by Sanjay Gangal Rambus Introduces DDR5 Client Clock Driver, Paving the Way for High-Performance Laptops and Desktops

EDACafe Editorial by Sanjay Gangal Accelerating AI-Driven Cloud Optimization: Inside Arm’s Partnership with Exostellar

CAD Engineer for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

MEMS & Sensors Executive Congress (MSEC 2024) at Château-Bromont Hotel in Bromont Quebec Canada - Oct 7 - 9, 2024

PCB West 2024 at Santa Clara Convention Center Santa Clara CA - Oct 8 - 11, 2024

DVcon Europe 2024 at Holiday Inn Munich City Center, Munich Germany - Oct 15 - 16, 2024

International Test Conference (ITC) at United States - Nov 3 - 8, 2024