Leaders from Amazon, Broadcom, Google, Intel, Keysight, and More to Speak at DesignCon 2021
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Leaders from Amazon, Broadcom, Google, Intel, Keysight, and More to Speak at DesignCon 2021

Taking place August 16-18 at the San Jose McEnery Convention Center, DesignCon 2021 will be joined by Drive World + ESC (Embedded Systems Conference)

SANTA MONICA, Calif. — (BUSINESS WIRE) — May 20, 2021DesignCon, the nation’s largest event for chip, board, and systems design engineers, today opened registration for its 2021 conference, August 16 through 18, featuring technical paper sessions, panels, tutorials, and boot camps spanning 14 tracks to provide engineers the information they need to solve design challenges now and plan how to improve designs in the future. DesignCon’s content will be joined by Drive World and the Embedded Systems Conference (ESC) program, enhancing the event by offering learning and networking in the automotive electronics/intelligence and embedded/IoT spaces. Furthermore, the event will take place at the San Jose McEnery Convention Center, which has received Global Biorisk Advisory Council (GBAC) STAR accreditation, as a facility that knows how to prepare, respond, and recover from infectious disease outbreaks and biohazard situations.

The electronic industry is expected to boost market growth in the forthcoming years. In fact, a recent report by IC Insights, Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021, forecasts semiconductor shipments will grow more than 13% in 2021, setting a new all-time annual record.

“The growing adoption of electronic devices across the globe is prompting the need for engineers and technologists to gain practical insights and knowledge to engineer the next generation of products,” said Suzanne Deffree, Group Event Director, DesignCon. “We’re thrilled to be able to provide our attendees the opportunity to learn from some of the brightest engineers in the industry and connect with the most innovative companies and products.”

Featured DesignCon Speakers Include:

Cathy Liu, Distinguished Engineer, Broadcom
Dr. Cathy Ye Liu, distinguished engineer and director, currently heads up Broadcom SerDes architecture and modeling group. Previously she worked as R&D director and distinguished engineer in Avago/LSI which acquired Broadcom. Since 2002, she has been working on high-speed transceiver solutions. Prior to this, she developed read channel and mobile digital TV receiver solutions. Her technical interests are signal processing, FEC, and modeling in high-speed optical and electrical transceiver solutions. She has published many journal and conference papers and holds 20+ US patents.

DesignCon 2021 Sessions:

Federico Centola, Lead EMC Engineer, Google
Federico Pio Centola spent nine years at Apple as a Senior Electromagnetic Technologist. In the technology group, he developed design methodologies and tools for the Apple EMC and Electromagnetic Design groups. He worked on iPhones, iPads, Apple Watches and different iMac products. In 2017, he has joined the Platform group at Google where he works as the Lead EMC Designer. Federico Centola has authored or co-authored a number of papers and patents. He has been serving for many years as reviewer for the IEEE Transaction on EMC.

DesignCon 2021 Session:

Medhi Mechaik, Sr. Signal Integrity Engineer, Amazon
Mehdi Mechaik has been working on package and board designs in the areas of Signal and Power Integrity applications for over 20 years. He has a BSc., MSc., and Ph.D. degrees in electrical and Computer Engineering, authored and co-authored over forty papers on computational electromagnetics, EMI/EMC, signal, and power integrity.

DesignCon 2021 Session:

Mike Li, Fellow, Intel Technologies
Dr. Peng (Mike) Li is an Intel Fellow and the technologist for high-speed I/O and interconnects at Intel Corporation. He serves as Intel’s technical expert and adviser in high-speed I/O and link technology; standards; SerDes architecture; electrical and optical signaling and interconnects; silicon photonics integration; optical field-programmable gate arrays (OFPGAs); and high-speed simulation, debug and test for jitter, noise, signaling and power integrity, from deign validation, to high-volume manufacturing (HVM). Li joined Intel in 2015 with the acquisition of Altera Corp., where he had held a similar role. Before joining Altera in 2007, Li spent nearly a decade at Wavecrest Corp., culminating in his seven-year tenure as CTO. He began his career in 1991 as a post-doctorate researcher at the Space Sciences Laboratory at the University of California, Berkeley. A distinguished scientist and technologist, Li has contributed extensively to industry standards during his career, including PCI Express, Ethernet, Optical Internetworking Forum (OIF), Fibre Channel, and Serial ATA.

DesignCon 2021 Sessions:

Mike Resso, Signal Integrity Application Scientist, Keysight Technologies
Mike Resso is the Signal Integrity Application Scientist in the Internet Infrastructure Group of Keysight Technologies and has over 25 years of experience in the test and measurement industry. His background includes the design and development of electrooptic test instrumentation for aerospace and commercial applications. His most recent activity has focused on the complete multiport characterization of high-speed digital interconnects using Time Domain Reflectometry and Vector Network Analysis.

DesignCon 2021 Sessions:

The full conference schedule can be viewed here. In addition to an expertly curated conference, the DesignCon expo will run August 17 and 18, featuring leading suppliers displaying the latest in high-speed design tools, technologies, and developments.

Featured DesignCon 2021 exhibitors include:

About DesignCon
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and two-day expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: www.designcon.com. DesignCon is organized by is organized by Informa, which recently acquired UBM to become a leading B2B information services group and the largest B2B events and exhibitions organizer in the world. To learn more and for the latest news and information, visit www.informa.com.

The health & safety of the DesignCon and Drive World+ESC community remains a top priority. Health and safety information can be found on DesignCon’s website and will be updated as venue and local protocols advance.

About Informa Markets
Informa Markets creates platforms for industries and specialist markets to trade, innovate and grow. Our portfolio is comprised of more than 550 international B2B events and brands in markets including Engineering, Healthcare & Pharmaceuticals, Infrastructure, Construction & Real Estate, Fashion & Apparel, Hospitality, Food & Beverage, and Health & Nutrition, among others. We provide customers and partners around the globe with opportunities to engage, experience and do business through face-to-face exhibitions, specialist digital content and actionable data solutions. As the world’s leading exhibitions organizer, we bring a diverse range of specialist markets to life, unlocking opportunities and helping them to thrive 365 days of the year. For more information, please visit www.informamarkets.com.



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