TOKYO – March 12, 2019 – More than 300 industry experts and thought leaders will gather May 22-23 in Tokyo’s Shinagawa District at the co-located  2019FLEX Japan and MEMS & Sensors Forum for critical insights into the latest flexible hybrid electronics (FHE) technologies and market opportunities. Hosted by FlexTech, a SEMI Strategic Association Partner, the leading FHE exhibition and conference will highlight the latest trends in IoT, Smart Transportation and MedTech in the Japan region.  Registration is now open.

Assembling experts from Belgium, France, Japan, South Korea and the United States, the two-day event offers two networking events for innovation, partnership and business opportunities, as well as four technical sessions: 

• FHE and Printed Electronics
• IoT Applications
• MEMS and Sensors
• Textiles

2019FLEX Japan and MEMS & Sensors Forum Keynotes

Dr. Meyya Meyyappan, Chief Scientist for Exploration Technology at  NASA’s Ames Research Center will offer insights into the latest printed electronics equipment and application developments. 

Wilfried Bair, VP of Technology at  NextFlex, will highlight FHE developments at NextFlex.

2019FLEX Japan will feature presentations from industry thought leaders on Smart Transportation, MedTech and Life Science, and Common Technologies for FHE.

SMART Transportation
Yole Développement, IBM Japan, ISORG, Shizuoka University, PNI Sensor, Velodyne LiDAR

MedTeck and Life Science
Jenax, Centexbel, Hiroshima City University, Osaka University, Daiwa House

Common Technologies for FHE
Fujitsu Advanced Technologies, Kitech, Gunma University, DNP

2019FLEX Japan will also feature tabletop exhibits by FHE, MEMS and sensors manufacturing supply chain players and electronics companies integrating these technologies.

View the program  agenda.

To showcase your products and technologies, visit  here or contact  Email Contact at +81.3.3222.5988.

About SEMI

SEMI® connects more than 2,260 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org.


Contact:

SEMI Japan
Mayumi Amagai
81.3.3222.5801
Email Contact