HSINCHU, Taiwan — (BUSINESS WIRE) — April 19, 2018 — TSMC (TWSE: 2330, NYSE: TSM), today filed its 2017 annual report on Form 20-F with the U.S. Securities and Exchange Commission.
The report is available at http://www.tsmc.com/download/ir/secFillings/20F-2017.pdf. Hard copies of the report are also available, free of charge, upon request via http://citibank.ar.wilink.com.
ABOUT TSMC
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and foundry’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company’s owned capacity in 2018 is expected to exceed 12 million (12-inch equivalent) wafers, including capacity from three advanced 12-inch GIGAFAB® facilities, four eight-inch fabs, and one six-inch fab, in Taiwan, as well as TSMC’s wholly owned subsidiaries, WaferTech, TSMC China, and TSMC Nanjing. TSMC is the first foundry to provide 7-nanometer production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.
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Contact:
TSMC Spokesperson
Lora Ho
Senior Vice President & Chief
Financial Officer
TEL: +886-3-5054602
TSMC Acting
Spokesperson
Elizabeth Sun
Senior Director, TSMC Corporate
Communications Division
TEL: +886-3-5682085
Email:
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For
Further Information
Michael Kramer
Project Manager, PR
Department
TEL: +886-3-5636688
Ext. 7125031
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