IBASE

“The next-generation performance and scalability delivered by the AMD Ryzen Embedded V1000 and AMD EPYC Embedded 3000 processors translates to real-world differentiation and benefits for our customers across networking and digital media applications.” said Jackson Mao, product planning division vice president, IBASE. “We developed the SI-324 Digital Signage Player with the AMD Ryzen Embedded V1000 to empower businesses with a stunning new level of video performance, multi-display support and flexible power consumption to support rich multimedia capabilities. Additionally, we are leveraging the AMD EPYC Embedded 3000 to develop agile networking solutions that bring the efficiencies of the datacenter to mainstream server networking systems.”

Kontron

“We expect to see many new opportunities for our products with the new AMD Ryzen Embedded V1000 processors in the industrial and embedded fields including medical, digital signage and gaming,” said Peter Mueller, director of product, Boards and Modules, Kontron. “These applications require high-performance computing in a cost sensitive environment, and we are very confident that the performance and value of the AMD Ryzen Embedded V1000 will enable our COM Express compact computer modules and mini-ITX embedded motherboard to reach a broader base of customers.”

“We are currently developing a new edge computing product line that – after doing extensive benchmark studies – is particularly useful when designed with the AMD EPYC Embedded 3000 processor for a specific use case,” said Benoit Robert, vice president, Strategy and Marketing, Communications Business, Kontron. “This is being supported with an engagement with a major customer and we plan to have trial seed units available by Q2.” 

Medwell

“Medical imaging has greatly benefited from recent advancements in graphics and displays, providing more clarity and a faster time to diagnosis. The enhanced resolution of the new AMD Ryzen Embedded V1000 helps to further improve the certainty of diagnosis and approach to procedures by offering crystal-clear imaging,” said Ping Huang, vice president, Medwell. “The AMD Ryzen Embedded V1000 is also available in a compact form factor with a 25W to 35W configurable TDP, making it a compelling processor for both our MEDM-B603 board designed for ultrasounds and our MEDM-B603 board designed for ultrasounds and surgical navigation equipment.”

Mentor Graphics

“Mentor is excited to continue its collaboration with AMD to now provide Embedded Linux solutions for the new AMD Ryzen Embedded V1000 and AMD EPYC Embedded 3000 processors. The suite of security features that AMD enables for these processors is well aligned with the extensive set of security features available in Mentor’s Linux products,” said Scot Morrison, ‎general manager, Embedded Platform Solutions, Mentor. “With embedded Linux solutions that scale across the broad range of power and performance enabled by these new AMD processors, this partnership can continue to provide significant value to our customers, and enable a host of connected, secure devices utilizing the outstanding computational throughput of the new AMD products.”

Sapphire

“Sapphire Technology is a longstanding AMD partner and leading supplier of components and solutions for a broad range of consumer and embedded products, with expertise in next-generation motherboards and graphics add-in boards for display-centric applications,” said Adrian Thompson, vice president of marketing, Sapphire Technology. “By leveraging the new AMD Ryzen Embedded V1000 as a key pillar in our latest Sapphire board, we can increase CPU and GPU performance in an integrated 5x5 inch form factor, driving extraordinary graphics capabilities, support for up to four simultaneous displays in 4K resolution, and unprecedented performance-per-watt for our customers.”

SECO

“We are pleased to announce the SECO COMe-B75-CT6 module based on the new powerhouse AMD Ryzen Embedded V1000 processors, which represents a significant milestone in our company roadmap,” said Gianluca Venere, director of global sales and chief strategy officer, SECO. “With an extraordinary balance between performance, graphics and power consumption, the AMD Ryzen Embedded V1000 will be the flagship foundation for our COM Express™ line of products, and the first in a long series of AMD-based SECO solutions.”

About AMD

For more than 45 years, AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ:AMD) website, blog, and Facebook and Twitter pages.

AMD, the AMD logo, Radeon, Ryzen, EPYC, and combinations thereof, are trademarks of Advanced Micro Devices, Inc. PCie is a registered trademark of PCI-SIG Corporation. Other names are for informational purposes only and may be trademarks of their respective owners.

1. Estimates based on SPECint®_rate_base2017 using the GCC-02 v6.1 compiler. AMD-based system scored 24.2 in tests conducted in AMD labs as of 12 January, 2018, configured with 1 x EPYC 3251 SOC ($315 per processor at AMD 1ku pricing), 32GB memory (2 x 16GB 2Rx4 PC4-2666 running at 2666), 1x 250 GB SSD, AMD Wallaby Rev C, RHEL 7.4. Intel Xeon D 1540 scored 16.1. based on tests conducted in AMD labs as of 12 January, 2018 using Supermicro Server System X10SDV-8C-TN4F, configured with 1 x Xeon D 1540 ($581 each processor per ark.intel/com), 32GB memory (2 x 16GB 2Rx4 PC4-2666 running at 2133),  1x 250 GB SSD, RHEL 7.4.EMB-152.
   
   
2. Comparison is based on performance measured using the 3dMark® 11P benchmark.  The AMD V-series V1807B scored 5618; the Intel Core i7-7700HQ scored 1783. The score for the Intel Core i7-7700HQ was measured using HP Omen with 8GB, Intel® HD 630 Graphics, 1x8GB DDR4 2400 RAM, 1TB 7200rpm HD, Microsoft Windows 10 Pro, Graphics Driver 21.20.16.4627, BIOS F.24. The score for AMD Ryzen Embedded V-Series V1807B was measured using the AMD “Dibbler” Platform, 2x8GB DDR4 3200 RAM, 250GB SSD Drive (non-rotating), TDP 45W, STAPM Enabled, ECC Disabled, Microsoft Windows 10 Pro, Graphics Driver 17.40-171114a-320676E-AES-2-wRV-E9171, BIOS TDB1100EA. EMB-146.
   
   
3. AMD EPYC™ Embedded 3451 supports up to 64 PCI Express high spend I/O lanes, 8 10 GbE, 16 SATA, and 4 memory channels versus Xeon D 1587 supports 32 PCIe lanes, 4 10GbE, 6 SATA, 2 memory channels. EMB-153.
   
   
4. Testing done at AMD Embedded Software Engineering Lab.  The AMD R-series Embedded SOC formerly codenamed "Merlin Falcon" scored 2399 and the AMD V-series V1807 scored 4978, when running 3dMark® 11P benchmark which measures GPU performance. (4978/2399=2.075) The AMD R-series Embedded SOC formerly called "Merlin Falcon" scored 273 and the AMD V-series V1807 scored 665 on Cinebench R15 nT which measures multi-threaded CPU performance. (665/273= 2.435). AMD Embedded R-Series RX-421BD used a AMD “Bettong” Platform, with a 2x8GB DDR4-2400 RAM, 250GB SSD Drive (non-rotating), TDP 35W, STAPM and ECC Disabled, Graphics Driver 17.40.2011-171026a-320350C-AES, BIOS RBE1306A. AMD Ryzen Embedded V-Series V1807B used the AMD “Dibbler” Platform with 2x8GB DDR4 3200 RAM, 250GB SSD Drive (non-rotating), TDP 35W, STAPM and ECC Disabled, Graphics Driver 17.40-171114a-320676E-AES-2-wRV-E9171, BIOS TDB1100EA.   Both systems ran Microsoft Windows® 10 Pro. EMB-144.
   
   
5. Testing done at AMD Embedded Software Engineering Lab on the Intel Core i3 -7100U.   The Ryzen 3 2200U was used to approximate the V1202B. The i3-7100U scored 254 and the AMD Ryzen 3 2200U scored 372 on Cinebench R15 nT benchmark which measures multi-threaded CPU performance. System Configurations: Intel Core i3-7100u: HP 15inch Notebook, i3-7100u with Intel® HD Graphics 620, 1x8GB DDR4-2133 RAM, 1 TB 5400 rpm SATA, Microsoft Windows 10 Pro, Graphics Driver 21.20.16.4627, BIOS F.07. AMD Ryzen 3 2200U: AMD “Mandolin” Platform, TDP 15W, STAPM enabled, ECC Disabled 2x4GB DDR4 2400 RAM, 512GB SSD Drive (non-rotating), Microsoft Windows 10 Pro RS3, Graphics Driver 23.20.768.0. EMB-147.
   
   
6. The Intel i7-7700HQ package size in FCBGA1440 is 28mm x 42mm = 1176mm2 versus the V1000 family in FP5 package 25mm x35mm = 875mm2 which is 26% smaller than the i7-7700HQ. Source From intel ARK website: https://ark.intel.com/products/97185/Intel-Core-i7-7700HQ-Processor-6M-Cache-up-to-3_80-GHz. EMB-150.
   
   
7. The equation makes assumptions for clock and uses16-bit floating point operands. FLOPS = 11 CU * 4 SIMD/CU * 4Shaders/SIMD * 4 MAC/Pixel * 4 FLOPS/Cycle/ALU * 1300MHz = 3.661 TFLOPS. EMB-151.