Broadcom

“The completion of Core Specification 1.0 by the Gen-Z Consortium represents a major milestone toward defining a new open systems interconnect and represents another step toward making this technology a reality.” – Fazil Osman, Broadcom Distinguished Engineer

Cavium

“The Gen-Z Consortium is driving innovations in Memory-Driven Computing enabling a new compute paradigm for a variety of applications, including the next generation data center, cloud, and high-performance computing. ThunderX2 is our second-generation 64-bit Armv8 server processor SoC family optimized to deliver high compute performance, outstanding memory bandwidth and memory Capacity. Cavium along with our partners was one of the first to demonstrate implementation of the Gen-Z interconnect on ThunderX2 ARM server. We are excited to be part of this effort to work with other member companies to significantly improve the performance and latency of key Cloud and HPC workloads.” – Gopal Hegde, VP/GM Data Center Processor Group at Cavium

Dell EMC

“Dell EMC is very encouraged to see Gen-Z Consortium’s release of their 1.0 spec. The application of Gen-Z in key workloads like Machine Learning, Data Analytics, and In-Memory Computing show that it is a critical part of the future of enterprise system architecture. When you couple this with the fact that it is an open industry standard then it fits very well into Dell EMC’s philosophy and product plans.” – Ashley Gorakhpurwalla, President and General Manager, Server Solutions Group, Dell EMC

Everspin Technologies

“Gen-Z, with its low latency, byte addressable memory semantic fabric, enables the value of high-speed persistent memory, like STT-MRAM, to scale far beyond what is possible today. With a focus on ease of use, reduced or elimination of software interaction, overcoming current architectural limitations, Gen-Z will be able to deliver unprecedented performance at scale. Everspin enthusiastically supports the open Gen-Z standard as part of our efforts to unlock the potential of STT-MRAM as persistent memory.” – Kevin Conley, CEO, Everspin Technologies

Hewlett Packard Enterprise

“The public release of the Gen-Z Core Specification 1.0 is a significant milestone to enable an open ecosystem of innovation in computing devices of every size, from the IoT edge to data centers to supercomputing. As one of the founding Gen-Z Consortium members, Hewlett Packard Enterprise will leverage Gen-Z’s fabric technology to advance HPE’s Memory-Driven Computing agenda to deliver an entirely new way of computing that will power the next wave of high-performance and data analytics applications for our customers.” – Alain Andreoli, Senior Vice President and General Manager, Hybrid IT Group, Hewlett Packard Enterprise

IntelliProp Inc.

“The release of the Gen-Z Core Specification 1.0 will kick start Gen-Z product development in earnest and IntelliProp is developing both IP Cores and ASSP product solutions. IntelliProp will release a full package of Gen-Z IP Cores, including Requester/Responder, that will support Rev 1.0 of the specification in the first quarter of 2018, for both FPGA and ASICs. Development also continues on the “Cobra” Gen-Z Hybrid Memory Controller, which has been used to support the Gen-Z Consortium demo. The “Cobra” media controller provides for low latency, fabric attached persistent memory storage using DRAM and NAND.” – Hiren Patel, VP of Business Development at IntelliProp Inc.

Mellanox Technologies

“The Gen-Z Consortium fosters eco-system discussions and developments of higher performance and richer capabilities for future data center connectivity. The release of the 1.0 Gen-Z Specification is a major milestone, which will enable companies and organizations to move into next level of implementations.” – Gilad Shainer, vice president of marketing at Mellanox Technologies

Micron

“2018 will provide a new era of opportunities, where data centers must make decisions in memory to respond quickly to the sheer volume of data being created and analyzed. The Gen-Z Specification provides a flexible foundation for customers to address near-term data opportunities like these and make the most of new memory technologies.” – Malcolm Humphrey, Vice President of Marketing for Micron’s Compute and Networking Business Unit

Microsemi

“The Gen-Z Core Specification 1.0 release will enable the first commercial products for memory-centric architectures. These solutions will deliver improved efficiency and performance for a wide variety of applications including in-memory databases, real-time analytics, high performance computing, and artificial intelligence. The broad coalition of Gen-Z members signals the strong commitment of both suppliers and customers to the emergence of products utilizing this open standard. Microsemi’s expertise in high speed signaling, low latency high bandwidth fabrics, data protection and security makes us a natural fit as an innovative supplier for this emerging market.” – Pete Hazen, Vice President and General Manager of Microsemi’s Data Center Solutions Business Unit

Samsung Electronics

“The release of core specification 1.0 today is a significant step towards realization of new architectures and evolution of existing technologies to expand into new roles. Samsung is excited to be a member of the Gen-Z Consortium and is committed towards industry open standards.” – Harry Yoon, Vice President of Memory Product Planning & Application Engineering Team, Samsung Electronics