Molex Spotlights High-Speed Data Connectivity and Expertise at DesignCon 2018

  • 10:00 to 10:45am, Wednesday, January 31
    • 112G Electrical System Performance Study Based on an Improved Salz SNR Methodology. The technical session will explore an early system design stage for 112G when no silicon nor hardware components are available, an improved Salz SNR analytical model is derived and a methodology for assessing system margin is introduced. Unlike traditional ICR based Salz method, major noise terms that are recognized to be dominant and are weighted much higher in PAM-4 than in NRZ systems are included. Performance 'upper limits' such as maximal tolerable insertion loss and crosstalk for 'optimal' modulation scheme is analyzed for six backplane architectures and those with higher possibility to meet the 'upper limits' are selected for full channel modeling and margin analysis. Molex experts will discuss how channel architectures are using most up-to-date Molex Backplane family of connectors such as Impulse Orthogonal Direct connectors and Impulse backplane cables as well as BiPass cable assemblies with near-ASIC connector family to solve design challenges.
  • 2:50 to 3:30pm, Wednesday, January 31
    • Fast Resonance Reduction Using Eigenmode Solution and Custom Metrics. The technical presentation will focus on the presence of resonant frequencies in electromechanical devices as one of the primary issues that inhibits the quality of high-speed data transmission. Signal integrity engineers typically spend a significant portion of the design process on finding and suppressing resonances; this is primarily due to the iterative nature and computational expense of using conventional frequency-domain solvers. Molex experts will discuss an alternative design approach and methods used to quickly identifying resonances in multi-ground connector and circuit board structures.

For more information about next-generation high-speed connectivity, please visit the Molex booth at DesignCon 2018 or www.connector.com/solutions/designcon.

About Molex:

Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, and commercial vehicle. For more information, please visit  www.molex.com.

Molex Resources:

Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.



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