Toshiba Memory America Adds UFS to Lineup of Embedded NAND Flash Memory Products for Automotive Applications

Key Features

1. Extended Temperature Range
Supports operating temperature range of -40°C to +105°C. Reliability tests were conducted to meet AEC-Q100 Grade2 specifications, in addition to JEDEC compliance tests.

2. Wide Capacity Range
Supports wide capacity range from 16GB to 256GB. Suitable for a wide variety of automotive applications, such as entertainment & information systems and ADAS, which typically require high-capacity storage, as well as other applications (such as wireless communication) that may need only smaller capacity.

3. High Performance
Realizes much higher performance compared to Automotive e-MMC.

4. Additional Functions
Supports additional functions designed for automotive applications, such as Refresh, Thermal Control and Extended Diagnosis.

5. Integrated NAND Flash Memory Management
The JEDEC UFS V2.1 compliant interface handles essential functions, including bad block management, error correction, wear leveling, and garbage collection. As a result, UFS devices simplify design when compared to standalone memory integrated circuits with a standard NAND flash interface.

Key Specifications

Interface       JEDEC UFS V2.1 standard

HS-G3 interface

Capacity       16GB, 32GB, 64GB, 128GB, 256GB

Power Supply Voltage

 

     

2.7-3.6V
1.7V-1.95V

     

(Memory core)
(Interface)

Temperature Range

     

-40oC to +105oC

Package       153Ball FBGA

11.5mm x 13.0mm

(16GB, 32GB, 64GB, 128GB)

      169Ball FBGA

12.0mm x 16.0mm

(256GB)

           

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