MACOM Announces Sampling of X-Gene® 3 Server-on-a-Chip® Solution
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MACOM Announces Sampling of X-Gene® 3 Server-on-a-Chip® Solution

X-Gene 3 Processor Underscores Readiness for Next-Generation Data Centers

SANTA CLARA, Calif. — (BUSINESS WIRE) — March 8, 2017 — MACOM Connectivity Solutions, LLC ("MACOM"), today announced the sampling of its third generation 16-nanometer FinFET Server-on-a-Chip® (SoC) solution, X-Gene® 3. Launched in November 2016 the X-Gene 3 SoC is the industry’s first ARMv8-A compatible processor that matches comparable x86 processors in CPU throughput, per-thread performance and power efficiency, while offering advantages in memory bandwidth and total cost of ownership. Key test results were released by The Linley Group in a white paper that can be accessed here.

The third-generation design features microarchitecture improvements, making it the most powerful ARM CPU available today. It features 32 ARMv8-A 64-bit cores operating at speeds up to 3.0 GHz, eight DDR4-2667 memory channels with ECC and RAS supporting up to 16 DIMMs and addressing up to 1TB of memory and 42 PCIe Gen 3 lanes with eight controllers. The processor is expected to have a performance that is up to six times that of the currently shipping X-Gene family of products.

To assist customers, MACOM has developed reference platforms for X-Gene 3 that support the full memory capacity, as well as several PCIe and SATA ports, other standard I/O and an AST2500 board-management controller (BMC) for platform management. The reference platform ships with the AMI AptioV UEFI BIOS and the industry standard CentOS server operating system.

“We are excited to announce that the X-Gene 3 performance and power measurements are exceeding our expectations,” said Kumar Sankaran, associate vice president of software and platform engineering for MACOM’s newly acquired compute business from AppliedMicro.

“With two products in production and a third on the way, X-Gene has already built a strong ecosystem that competitors have yet to match,” said Linley Gwennap, principal analyst, The Linley Group. “X-Gene 3 can handle a broad range of cloud workloads, including scale-up and scale-out applications. The processor excels on big data, particularly in-memory databases, because of its high memory bandwidth. With X-Gene 3, ARM is ready for the cloud.”

“We’re seeing unprecedented demand for the X-Gene 3 evaluation platforms from our customers in all geographies and welcome the opportunity to sample it to them to allow for further evaluation of the technology,” said Parag Jain, associate vice president of processor products for the compute business unit of MACOM.

X-Gene 3 is now shipping to select customers. For more information, visit MACOM at booth no. C19 at OCP U.S. Summit, Wednesday, March 8 – Thursday, March 9, in Santa Clara where we will be showing live demonstrations.

ABOUT MACOM:

MACOM is a new breed of analog semiconductor company—one that delivers a unique combination of high growth, diversification and high profitability. We are enabling a better-connected and safer world by delivering breakthrough semiconductor technologies for optical, wireless and satellite networks that satisfy society’s insatiable demand for information.

Today, MACOM powers the infrastructure that millions of lives and livelihoods depend on every minute to communicate, transact business, travel, stay informed and be entertained. Our technology increases the speed and coverage of the mobile Internet and enables fiber optic networks to carry previously unimaginable volumes of traffic to businesses, homes and data centers.

Keeping us all safe, MACOM technology enables next-generation radars for air traffic control and weather forecasting, as well as mission success on the modern networked battlefield.

MACOM is the partner of choice to the world’s leading communications infrastructure and aerospace and defense companies, helping solve their most complex challenges in areas including network capacity, signal coverage, energy efficiency, and field reliability, through its best-in-class team and broad portfolio of RF, microwave, millimeterwave and lightwave semiconductor products.

MACOM is a pillar of the semiconductor industry, thriving for more than 60 years of daring to change the world for the better through bold technological strokes that deliver true competitive advantage to customers and superior value to investors.

Headquartered in Lowell, Massachusetts, MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has design centers and sales offices throughout North America, Europe, Asia and Australia.

MACOM, M/A-COM, M/A-COM Technology Solutions, M/A-COM Tech, Partners in RF & Microwave, The First Name in Microwave and related logos are trademarks of MACOM. All other trademarks are the property of their respective owners.

For more information about MACOM, please visit  www.macom.com follow  @MACOMtweets on Twitter, join MACOM on  LinkedIn, or visit the MACOM  YouTube Channel.

DISCLAIMER FOR NEW PRODUCTS:

Any express or implied statements in MACOM product announcements are not meant as warranties or warrantable specifications of any kind. The only warranty MACOM may offer with respect to any product sale is one contained in a written purchase agreement between MACOM and the purchaser concerning such sale and signed by a duly authorized MACOM employee, or, to the extent MACOM's purchase order acknowledgment so indicates, the limited warranty contained in MACOM Connectivity Solutions's standard Terms and Conditions for Quotation or Sale.


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