Experts to present two technical sessions addressing verification and power efficiency and additional technical trainings explore system design challenges for memory and serial links
SUNNYVALE, Calif. — (BUSINESS WIRE) — January 24, 2017 — Rambus Inc. (NASDAQ: RMBS):
| Who: |
Rambus Inc. (NASDAQ: RMBS) |
|
| Where: | DesignCon | |
| Booth #833 | ||
| Santa Clara Convention Center | ||
| 5001 Great America Pkwy | ||
| Santa Clara, CA 95054 | ||
| When: | January 31 – February 2, 2017 (Conference) | |
| February 1 – 2, 2017 (Expo) |
Join Rambus at DesignCon for product demonstrations showcasing its comprehensive suite of Ethernet, PCIe and DDRn IP solutions to solve today’s most challenging data center and networking applications. Rambus technical experts, executives and partners will also be holding a series of talks and technical training sessions listed below.
Rambus Technical Session Details:
Title: Power
Delivery Network Design and Optimization for High-Speed Systems with Si
Interposer
Date: Wednesday, February 1, 2017
Time:
9:00 am – 9:45 am
Location: Ballroom A
Speaker:
Wendem Beyene, Technical Director, Rambus
Title: Methodology for Reusing the Verification Tests and Efforts
Beyond Pre-silicon Verification
Date: Thursday, February 2,
2017
Time: 3:00 pm – 3:45 pm
Location: Ballroom C
Speakers:
Dinesh Malviya, Sr. Manager Engineering, Rambus; Sujith Hiremath, Senior
Member of Technical Staff - Verification, Rambus
Rambus Training Sessions:
Title: An 8b ADC for a
56Gbps PAM4 Receiver
Date: Wednesday, February 1, 2017
Time:
9:20 am – 10:00 am
Location: Great America 3
Speakers:
Kenneth C. Dyer, Senior Principal Engineer Architect, Rambus; Shankar
Tangirala, Principal Design Engineer, Rambus
Title: ADC-Based Link Architecture for Multilevel Signaling at 56G
Date:
Wednesday, February 1, 2017
Time: 10:15 am – 10:55 am
Location:
Great America 3
Speakers: Masum Hossain, Senior Principal
Engineer, Rambus; Nhat Nguyen, Sr. Director of Engineering, Architecture
& Design, Rambus
Title: PCI Express PHY and Controller Integration at Gen4: PLDA’s
Proven Methodology for First-Time Silicon Success
Date:
Wednesday, February 1, 2017
Time: 11:05 am – 11:45 am
Location:
Great America 3
Speaker: Trupti Gowda, Field Application
Engineer, PLDA Inc.
Title: Design and Modelling of 2.5D HBM2 Interposer System
Date:
Wednesday, February 1, 2017
Time: 2:00 pm – 2:40 pm
Location:
Great America 3
Speaker: Yuri Tretiakov, Principal Engineer,
Systems / IC Package Design, Rambus
Title: SI and PI Challenges of a 2.5D HBM2 Interposer System
Date:
Wednesday, February 1, 2017
Time: 2:50 pm – 3:30 pm
Location:
Great America 3
Speakers: Ravi Kollipara, Technical
Director, Engineering, Rambus; Joohee Kim, Senior Member of Technical
Staff II, Rambus
Title: HBM2 Controller and PHY Integration
Date:
Wednesday, February 1, 2017
Time: 3:45 pm – 4:25 pm
Location:
Great America 3
Speaker: Brian Daellenbach, President,
Northwest Logic
For additional information on Rambus products and solutions, please visit rambus.com.
Follow Rambus:
Company website:
rambus.com
Rambus blog:
rambusblog.com
Twitter:
@rambusinc
LinkedIn:
www.linkedin.com/company/rambus
Facebook:
www.facebook.com/RambusInc
About Rambus Inc.
Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.
View source version on businesswire.com: http://www.businesswire.com/news/home/20170124006629/en/
Contact:
Rambus Corporate Communications
Agnes Toan, 408-462-8905
Email Contact