Keysight Technologies, Molex, Anritsu Co. and others provide sneak peek of news ahead of January 31-February 2 event in Santa Clara, CA

SAN FRANCISCO, Jan. 23, 2017 — (PRNewswire) —  Today, DesignCon previews announcements from more than 50 exhibitors participating at the event next week. DesignCon, the premier educational conference and technology exhibition for electronic design engineers in the high-speed communications and semiconductor communities, will present three days of deeply technical sessions, special events and a robust expo hall hosting the industry's leading solution providers. Via the expo hall, attendees will have the opportunity to experience emerging solutions first hand and connect with leading companies on what's to come.

DesignCon will take place January 31 – February 2 at the Santa Clara Convention Center. For additional information and to register, please visit: designcon.com

Below is a preview of announcements exhibitors will showcase at DesignCon 2017: 

3M (booth 514) announces Twin Axial Cable Assemblies that bring incredible flexibility in an ultra-thin, space-saving form. Featuring a low-profile ribbon design with a remarkably tight bend radius, it can help save substantial space inside congested systems, allowing for optimal airflow and cooling to maintain the speeds and power your system demands.

Anritsu (booth 633) will display signal integrity solutions featuring its Signal Quality Analyzer MP1800A BERT, VectorStar® and ShockLine™ VNAs. Demos include a 56G/112 NRZ and PAM4 Accurate Jitter Tolerance Test System that satisfies communications standards such as OIF, IEEE, and InfiniBand.

Applied Simulation Technology (booth 1149) introduces Mesh Gnd module for accurate modeling of flex circuits and other mesh ground/power structures on PCBs. Mesh Gnd is a new feature set of ApsimRLGC 2D+ field solver. ApsimRLGC now also expands its capability by adding an optimizer which helps synthesize trace parameters for ZO optimization.

Artek, Inc. (booth 309) will be introducing all new, all passive & tunable ISI, XTalk, Tr/Tr, Skew controllers for receiver physical layer tolerance testing.

Bellwether (booth 652) will showcase both Hi Speed & Hi Power connectors and cables. Cable such as SlimChroma™ can be used to meet USB 3.0/3.1 signal integrity requirements. Connectors such as CrystalBand™ can provide excellent connectors capable of handling high electrical current in small space.

Benchmark Electronics (booth 301) announces expanded RF development capabilities and is showcasing their latest innovations in electronics design expertise. Benchmark services have been providing advanced product engineering and manufacturing solutions in high-speed computing, telecommunications and related industries for over a quarter century.

Cadence (booth 515) will show how designers can optimize signal and power integrity design and analysis as well as get support for designing with the PCIeÒ 4.0 interface.

EDADOC USA (booth 518) will showcase new service offerings for turnkey solutions in addition to their high-speed PCB design capabilities.

EMSCAN (booth 211) significantly improves the speed and the resolution (0.06 mm) of the world's fastest EMC/EMI scanner: the EMxpert ERX+. Now PCB and design engineers can diagnose EMC/EMI issues on a 2.25 cm x 2.25 cm (0.89" x 0.89") sized PCB at 0.1 mm in less than 9 minutes.

Feinmetall (booth 1153) is proud to introduce its new RF HF66 series for reliable contacting of SMD assembled RF mini connectors and new coaxial high current 1860 series suitable for formation/test of Li-ion cells, quality control of batteries/power storage and charging, and discharging processes of batteries.

Hitachi Cable America (booth 811) will showcase new product and service offerings including Direct Attach Cables (DAC), DensPac, ACC and more.

HSIO Technologies (booth 423) has a new line of Zero Footprint Sockets that incorporates a device size socket footprint with industry standard spring pins. These small test sockets allow a customer to place them into any end application allowing a Spring Pin socket to be directly re-flowed into the same location as the device.

Huwin (booth 1152) will introduce a new USB 3.1 Type C test solution. It contains test fixtures and a compliance test software. The test fixtures have been optimally designed to measure any USB 3.1 Type C connectors using a commercial network analyzer.

Imagineering (booth 1240) announces it is now AS9100C Certified for printed circuit boards and Assemblies. This certification is an internationally recognized standard focused on quality requirements necessary in the Defense and Aerospace industry.

Ironwood Electronics (booth 752) introduces a new BGA socket family using high performance elastomer capable of 75GHz, very low inductance and wide temperature applications (-55C to +160C). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).

Kandou Bus (booth 218), together with Keysight, will demonstrate the Glasswing Ultra-Short-Reach PHY that uses Chord Signaling to deliver sub-pico Joule per bit in-package communications. The PHY delivers 125 Gb/s over 6 data wires.

Keysight Technologies (booth 725) will demonstrate new test and measurement techniques for 400G/PAM-4 designs, data analytics, digital interconnect test and physical layer test and will provide complimentary workshops on these technologies. Keysight specialists will be available to discuss new services for calibration and technology refresh plus training and consulting.

Luxshare-ICT (booth 801) will be showcasing its OCuLink 4x Enhanced Vertical receptacle along with a 2 x 4x solution for x8 OCuLink applications. Luxshare's Type C, Power assemblies, Standard I/O, FFC/FPC, Power Bus Bar, Braided Copper Cables, SAS, PCIe, Magnetic Jacks, Active Optical Cables, and JDM Capabilities will all be available to discuss with its engineering team.

Micram (booth 658) launches new and enhanced features for its ultrafast 100 GS/s, 35 GHz bandwidth VEGA DAC4 signal generator, which now supports fully automatic synchronization of two and four channel configurations. Software enhancements include rational sampling, fully adjustable channel skew and predefined filters, pre-distortion, pre-compensation, noise cancellation, PAM-4/PAM-8 and other complex patterns.

Microlease (booth 222) will be leading hands on demonstrations with the latest test and measurement equipment from Keysight and Tektronix.

From the publishers of Microwave Journal comes an online journal specializing in signal integrity, power integrity, and EMC/EMI: Signal Integrity Journal (booth T2). The Editorial Advisory Board includes DesignCon luminaries Eric Bogatin (Editor), Bert Simonovich, Yuriy Shlepnev, Istvan Novak, Alfred Neves, Doug Smith, and Vladimir Dmitriev-Zdorov. Contributing: Janine Love & Patrick Hindle.

Molex (booth 619) will showcase versatile, high-density, space-saving connectivity solutions that are rapidly increasing network bandwidth is the crux of next-generation system architectures. Advancements in Molex technologies provide clear paths to adoption of higher data transmission rates that are in demand by manufacturers today.

National Instruments (booth 705) announces new higher performance model of VirtualBench with 500 MHz of analog bandwidth and 40 MHz sine output for higher performance benchtop and automated test applications. VirtualBench consolidates five of the most commonly used test and measurement instruments into one device without compromising performance, creating new efficiencies for engineers.

Neoconix (booth 320) announces the availability of new DLBeam™ enhancements to its PCBeam™ connector products. Engineered specifically for high speed applications, the DLBeam construction utilizes a more streamlined electrical path with reduced capacitance to further improve signal integrity. DLBeam has been developed for data rates up to 56Gbps.

Novotech Technologies (booth 207) will showcase wireless products/solutions with a focus on the new CAT M technology which is predicted to be a true game changer for the Internet of Things.

Oak-Mitsui Technologies (booth 1244) is thrilled to announce the launch of its thinner product MC2TS which offers 40 nf/sq in capacitance and 18 Dk @1 KHz. MC2TS is perfect for small factor applications such as MEMs and modules with space limitation that require higher capacitance.

Cross-Correlator ASIC is one of Pacific Microchip Corp.'s (booth 1237) unique products that was developed under NASA SBIR contract. The ASIC has greatly reduced power consumption and includes an array of 128 ADCs with 2-bit precision sampled at 1 GHz and a 64x64 cross-correlation matrix based on a novel architecture.

PacketMicro (booth 755) is excited to showcase the complete hardware and software solution for Intel Delta-L+ test methodology that allows PCB manufacturers to easily measure the PCB loss and extract Dk and Df. This solution includes an R&S ZNB20 VNA, EMStar Advanced Interconnect Test Tool (AITT) software, and rugged handheld D-Probes.

Paricon Technologies (booth 400) will present its latest technologies in its new ribbon cable to board connector system which introduces minimal signal degradation between the cable and the PWB. Using its patented PariPoser® contact system, very high performance electrical interconnection capability can be obtained for a wide range of applications including test and production interconnection products.

PCB Droid (booth 1341) will display its easy-to-use and easy-to-learn 'WYSIWYG' printed circuit board design application for Android mobile devices. It has an ergonomic menu structure designed for touch screens, and offers an extended macro library.

Polliwog Corporation (booth 1057) will showcase DFx which allows users to reduce expense and loss of time occurring in a mass production cycle. Numerous electrical defect items are checked against the PCB design data, and any design errors are reported at the point of error so that they are easily identified and corrected.

Pulse Electronics' (booth 632) is excited to be displaying the Pulse JT7 product line of 1 x1, 1, 10GBASE­T ICM, 4P POE with options for 4 and 5 Channel magnetics, PH9400 SMT high isolation gate drive transformers, SMPTE292M Video Baluns and Militarized Ethernet and AFDX products.

RoBAT Ltd. (booth 200), is excited to announce the release of two new robotic test machines: The RCI machine is a fully automated 4-head high speed VNA/TDR tester for Backplane assemblies. The PDM machine will detect the presence of pressfit pins and backdrills on both Backplane and Daughtercard assemblies.

Rohde & Schwarz (booth 841) will be featuring test solutions for challenges in high speed digital design and signal integrity as well as power integrity measurement solutions. The setups cover crosstalk, PAM-4 measurements, high bit rate channel characterization, low noise probing for signal integrity, battery life analysis, and high speed PCB probing.

SIGLENT Technologies (booth 402) will be displaying its latest developments in oscilloscopes, DMMs, spectrum analyzers, and generators.

SL Power (booth 642) will showcase its external and internal power supplies that address the Department of Energy's (DOE's) Level VI efficiency requirements, as well as enhanced performance to electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards for applications in test equipment, medical devices, and specialized LED lighting equipment.

Socionext (booth 1239) will feature advanced SoC design and solutions including ultra energy-efficient 56Gb/s PAM4 and 56Gb/s NRZ analog and ADC-based SR to LR CMOS transceivers, 100+Gbps transceiver utilizing the company's ultra-high speed ADC & DAC technology, and high-end package designs for high-performance SoCs.

Southwest Microwave (booth 411) will showcase its SuperMini Board-to-Board DC to 67 GHz blind-mate connectors for PCBs stacked as tightly as 3 mm. Southwest Microwave will also display its SuperSMA, 2.92, 2.40, 1.85, 1.0, and 0.9 mm End Launch Connectors and its matching cable and harness assemblies.

Spectra7 Microsystems (booth 803) will showcase the GaugeChanger and GaugeChanger Plus line of data center interconnects and components. Using Spectra7's patented active cable technology, the GaugeChanger series of ICs and cable modules enable the thinnest 3 meter and 5 meter QFSP cables used in rack-to-rack applications.

SPISim (booth T6) announces enhanced IBIS-AMI and link analysis capabilities in latest 2017.1 SPIPro release. Datasheet based cross-platform AMI models for FFE, CTLE, DFE and CDR stages can be configured and generated directly from SPIPro.

SV Microwave (booth 1055) manufactures a large variety of solderless precision RF connectors in high frequency bands including SMA, 2.92mm and 2.4mm connector series. Our solderless application makes assembly fast, easy and without damaging the PCB board. Additionally, SV can customize a PCB footprint design for your application.

T Plus Co. Ltd. (booth T4) will showcase 67GHz Wide pitch Probes, 40GHz Handheld probes, 26.5-170GHz standard RF probes and a variety of custom designed DC/RF probes. Additionally, T Plus Co. Ltd. will provide a Manual Probe Station as well as displayed measurement accessories.

Tektronix (booth 741) will be showcasing its comprehensive set of solutions for automated transmitter and receiver test solutions for data center technologies and emerging serial bus standards along with automated test solutions. Tektronix will also launch an exciting new product that will help engineers ease 4th generation receiver testing.

Teledyne LeCroy (booth 733) will showcase the HDO family of 12-bit high definition oscilloscopes; PAM4 signal analysis; digital power management IC, power sequencing, and power-integrity testing; USB 3.1 and Power Delivery compliance test over Type-C; MIPI M-PHY physical- and protocol-layer test; PCI Express Tx/Rx compliance; and DDR4 compliance and debug capabilities.

TestEquity (booth 648) provides value-added electronic test and measurement solutions, MRO tools, recently acquiring JENSEN® Tools, and in-house line of environmental test chambers. TestEquity works alongside customers to find the best solutions for specific needs, offer unmatched post-sale support and industry-leading warranties. TestEquity is an authorized stocking distributor for hundreds of leading manufacturers.

Total Phase (booth 603) will showcase the new Advanced Cable Tester - the quickest and most convenient way to test USB Type-C cables. The Advanced Cable Tester provides thorough continuity testing, DC resistance measurement for safe operation/reliability, and E-Marker verification. Rapid spot-checking of cables, easy-to-understand reports, and 100% test coverage are also features of this tester.

TOYO Corp. (booth 815) will be demonstrating the latest EMIStream Ver5.0 (EMI Simulation Software) from NEC and 67GHz near-field EMI scanner from Aprel. TOYO Corp. is also excited to showcase the latest PCB materials from Risho and high-frequency low-loss cables from Junkosha.

Ventec International (booth 118) will unveil the industry's most advanced ultra-low Dk PCB materials for high-speed low-loss applications. A technical presentation on the subject will demonstrate how lower losses and lower system power requirements are realized by using an ultra-low Dk material with Dk values between 2.3 and 2.8.

Wurth Electronics Midcom (booth 949) is presenting for the first time a seminar on High-Speed EMI Prevention Techniques Wednesday, February 1 at 9:20am. Attendees can also stop by the booth on Wednesday and Thursday from 1-3pm to meet presenter Ismael Molina Alba, Product Manager for CMCs, and ask him questions about his presentation and more.

Yamaichi (booth 1049) will present 200GbE/400GbE, and Coherent Optics Interconnect Products. Its CFP2, CFP4, CFP2-64G and CFP8 connectors perform at high speed signal requirements 200GAUI-4 and 400GAUI-8 on 200G/400GbE, and also perform at 64Gbaud signal requirement for Future Coherent Optics. Yamaichi will display demos showcasing these connectors' performances.

For the full list of DesignCon 2017 exhibitors, please visit: 
http://www.designcon.com/exhibitors-list

DesignCon Media & Association Partners
DesignCon is proud to partner with the following publications: Aspencore, Chinese American Semiconductor Professional Association (CASPA), Chip Design Magazine, ConnectorSupplier.com, EDA Café, Electronic System Design Alliance, Embedded Systems Engineering, How2Power, IBIS Open Forum, Microwave Journal, Signal Integrity Journal.

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About DesignCon 
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country.  This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at:  designcon.com/santaclara. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit  ubmamericas.com.

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