SANTA CLARA, Calif. and VIENNA, Austria, Feb. 22, 2016 (GLOBE NEWSWIRE) --
Applied Micro Circuits Corporation (Nasdaq:AMCC), a global leader in computing and connectivity solutions, and Theobroma Systems today announced that the HeliX™ 2 COM Express Module featuring AppliedMicro’s HeliX 2 System on a Chip®, designed specifically for industrial embedded applications, will become available from production in Q2, 2016. This joint effort builds upon four years of close collaboration between the two companies with Theobroma Systems supporting AppliedMicro with software engineering expertise and performance tuning for ARM®v8 on its X-Gene® platforms.
“We have had the privilege to experience, first-hand, the evolution of the X-Gene architecture from FPGA-based verification boards to a market-proven processor for data centers, network appliances, and cloud computing,” said Dr. Philipp Tomsich, chief technology officer for Theobroma Systems. “With the optimized HeliX 2 processor, we have the unique opportunity to extend the benefits of the X-Gene family into the application domain that our company has focused on since its inception: networked, embedded industrial applications.”
The COM Express System on Module (SoM) features the HeliX 2 processor with SO-DIMM slots for flexible ECC-enabled memory configurations using industry-standard memory modules. On-module flash storage provides for a module bootable without any external peripherals and ensures reliable storage for embedded operating systems, customer applications and user data. An enhanced COM Express pin-out takes advantage of the full capabilities of the HeliX 2 processor, including integrated 10 Gigabit Ethernet.
“AppliedMicro’s powerful Helix 2 processor architecture has the flexibility to address a wide range of embedded markets with our 64-bit ARMv8 technology,” said Michael Girvan Lampe, vice president of worldwide sales and marketing, AppliedMicro. “Theobroma Systems has been an ideal partner to collaborate with on this module as we expand and broaden our access to OEMs in the industrial automation, telecom infrastructure, networking, and storage markets.”
The HeliX 2 COM Express Development Platform complements the HeliX2 COM Express Module by adding a carrier board that enables full I/O access to form a complete evaluation platform. This allows development and testing with the same COM Express module that will be deployed in production, enabling rapid time to market. Key features of the HeliX 2 COM Express Development Platform include:
- 10 Gigabit Ethernet and 1 Gigabit Ethernet network interfaces
- PCI Express® Gen 3 expansion
- SATA 3 for enterprise-grade mass storage connectivity
- USB 2.0 for connecting standard peripherals
- Slot for an ‘intelligent HMI module’ with HDMI® and dual-channel LVDS for visual computing
- Embedded interfaces (UART, SPI, I2C, SD, GPIO) for quick proto-typing
The HeliX 2 COM Express Development Platform will be available through both AppliedMicro’s and Theobroma’s distribution channels. HeliX 2 COM Express Modules will be available directly from Theobroma Systems and through channel partners. The design documentation of the newly announced product will be made available as a reference design to AppliedMicro’s customers through myAPM.com.
The development platform will be shown at Embedded World 2016 in Nuremberg, Germany (Feb 23 through Feb 25, 2016), at booth 4A-110.
About Theobroma Systems
Theobroma Systems is a leading provider of embedded systems solutions for industrial and high-assurance applications. Theobroma Systems provides engineering services and turnkey system-on-module designs, accelerating time-to-market and lowering project risk for customers. The company is located in Vienna, Austria. www.theobroma-systems.com .
About AppliedMicro
Applied Micro Circuits Corporation (NASDAQ:AMCC) is a global leader in computing and connectivity solutions for next-generation cloud infrastructure and data centers. AppliedMicro delivers silicon solutions that dramatically lower total cost of ownership. Corporate headquarters are located in Santa Clara, California. www.apm.com.
(C) Copyright 2016 Applied Micro Circuits Corporation, AppliedMicro, X-Gene, X-Weave, Server on a Chip, and Cloud Server are trademarks or registered trademarks of Applied Micro Circuits Corporation. All other product or service names are the property of their respective owners.
Media Contact: Applied Micro Circuits Corporation Mike Major Phone: (408) 542-8831 E-mail: mmajor@apm.com Theobroma Systems GmbH Jennifer Hetzl Phone: +43 1 2369893-301 E-mail: jennifer.hetzl@theobroma-systems.com