What
Sidense will be exhibiting at the North American TMSC Technology Symposiums (San Jose, CA, Austin, TX and Boston, MA), discussing its low-cost, secure and reliable 1T-OTP non-volatile memory (NVM) IP, available from 180nm to 20nm including HV and BCD process nodes.

Where and When
San Jose, CA
Tuesday, April 7, 9:30AM-5:30PM
San Jose McEnery Convention Center
150 West San Carlos Street
San Jose, CA 95113
Booth #201

Boston, MA
Tuesday, April 14, 9:30AM-5:30PM
Marriott Burlington Boston
One Burlington Mall Road
Burlington, MA, 018031

Austin, TX
Thursday, April 16, 9:30AM-5:30PM
Hilton Austin (Downtown)
500 E 4th St.
Austin, TX 78701

About Sidense Corp.
Sidense Corp. provides very dense, highly reliable and secure non-volatile one-time programmable (OTP) Logic Non-Volatile Memory (LNVM) IP for use in standard-logic CMOS processes. The Company, with over 120 patents granted or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse™ bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-OTP macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming and device configuration uses.

Over 130 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-OTP as their NVM solution in more than 400 designs. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit www.sidense.com.

About the TSMC Technology Symposiums
Join the 21st annual TSMC Technology Symposiums and get first-hand updates on TSMC's advanced and specialty technologies, advanced backend capabilities and future development plans.

For more information or to schedule a meeting with Sidense please contact:

Jim Lipman

Email Contact
925-606-1370