Singapore, Dec 17, 2014 – STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – SGX-ST: STATSChP), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked for the fourth consecutive year among the world’s top 20 semiconductor manufacturing companies in the Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the world’s largest professional association for the advancement of technology.

The 2014 Patent Power Scorecards are based on an analysis of U.S. Patent and Trademark Office records through the end of 2013.  The patent portfolios of more than 6,000 leading commercial enterprises, academic institutions, nonprofit organizations, and government agencies worldwide were reviewed and benchmarked by 1790 Analytics, an Intellectual Property (IP) evaluation firm. Organizations were measured by the size of their patent portfolio, level of activity for the year and quality of the patent portfolio in terms of growth, impact, originality and general applicability.

STATS ChipPAC is the only Outsourced Semiconductor Assembly and Test (OSAT) service provider ranked among the top 20 companies in the Semiconductor Manufacturing category. STATS ChipPAC has been the leading U.S. patent holder among OSAT providers worldwide since 2011. In total, STATS ChipPAC has been granted more than 1,300 patents by the U.S. Patent and Trademark Office (USPTO), of which 246 issued patents were evaluated for the 2014 Patent Power Scorecard. STATS ChipPAC has built up a patent portfolio in which advanced or future technologies comprise more than 60% of its IP, significantly higher than other OSATs in the industry.

“Technology and manufacturing innovations are essential in providing our customers with the advanced packaging and test solutions they need to address complex, rapidly changing product requirements. Our depth of knowledge and constant drive for innovation have been instrumental in helping our customers launch a number of exciting new products in their markets,” said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. “What differentiates our IP development is the focus we have on advanced technologies such as wafer level packaging, flip chip interconnect and 2.5D/3D integration which provide strategic value to our customers.”