Industry's First LIN Devices to Comply With New OEM Hardware Recommendations and Scalable Functionality to Improve Overall System Cost

SAN JOSE, Calif., Nov. 5, 2014 — (PRNewswire) —   Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced the company has launched its next-generation family of local interconnect networking (LIN) transceivers, system basis chips (SBC) and voltage regulators for automotive body, power-train, infotainment sensor, actuator applications and more. The new family is the industry's first to comply with the new original equipment manufacturer (OEM) hardware recommendations and provide scalable functionality to improve the overall system cost.

All the new devices in this new family feature an LDO with outstanding minimum supply voltage of 2.3V combined with linear mode current of 130uA to support data storage even during an unexpected shut down. This new family is compliant with the latest standards including LIN 2.0, 2.1, 2.2, 2.2A and SAEJ2602-2. Some members of the family also include application specific functions such as relay drivers, watchdog, high-side switches and wake up inputs to enable system designers to build innovative in-vehicle network applications in next-generation automobiles.

The devices are available in DFN packages with heat-slug and wet-able flanks to support optical solder inspection. These next-generation devices also provide a family package footprint so that designers can upgrade their designs with various devices within the LIN SBC family.

"As the leading provider of automotive LIN ICs, Atmel is committed to bringing more innovative LIN products to the market," said Claus Mochel, marketing director for automotive high voltage products, Atmel Corporation. "Our expanded LIN portfolio includes pin-outs that are the first to support the new OEM hardware recommendations enabling system designers to develop differentiated LIN systems in next-generation vehicles. Atmel's LIN family footprint makes it easier to migrate upwards and devices in the family offer application-specific functionality for various LIN-connected applications such as window lifters, sun-roofs, trunk opener or seat controls."

Key Features of Atmel's ATA6632/33/34

• + 3.3V/5V/85mA LDO suitable for usage with low-cost multi layer ceramic capacitors
• 2.3V lowest operating voltage
• Very low current consumption in linear mode (2V < VS < 5.5V): typically 130μA – supporting emergency data write back to Flash in an unforeseen shut down situation
• Sleep current <15µA; Normal mode current <290µA
• DFN 8 (3x3mm) and DFN16 (3*5.5mm), wet-able flanks included, allowing automatic optical inspection of the solder joint

Design Support

To accelerate the design development, an evaluation kit is also available to support the new LIN devices. The ATAB663xxxA development kit allows designers to quickly start designing with Atmel's LIN family. The kit is easy-to-use with a pre-defined set-up. All pins are easily accessible for quick testing. The kits allow designers to select master or slave operation with a mounting option for LIN pull-up resistor and series diode.

Availability

Samples for all family members are available now.

More Information

Atmel LIN Family: http://www.atmel.com/products/automotive/lin/default.aspx   
Atmel Automotive-qualified MCUs: http://www.atmel.com/products/automotive/default.aspx
Embedded Design Blog: www.atmelcorporation.wordpress.com
Atmel YouTube Channel at www.atmel.com/youtube
Twitter: www.atmel.com/twitter
Facebook: www.atmel.com/facebook
Linked In: www.atmel.com/linkedin

About Atmel

Atmel Corporation (NASDAQ: ATML) is a worldwide leader in the design and manufacture of microcontrollers, capacitive touch solutions, advanced logic, mixed-signal, nonvolatile memory and radio frequency (RF) components. Leveraging one of the industry's broadest intellectual property (IP) technology portfolios, Atmel is able to provide the electronics industry with intelligent and connected solutions focused on the industrial, consumer, communications, computing and automotive markets.

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