Converter housed in Package (ChiP) Platform
Vicor's ChiP platform sets best-in-class standards for a new generation of scalable power modules. Leveraging advanced magnetic structures integrated within high density interconnect (HDI) substrates with power semiconductors and control ASICs, ChiPs provide superior thermal management supporting unprecedented power density. Thermally-adept ChiPs enable customers to achieve low cost power system solutions with previously unattainable system size, weight and efficiency attributes, quickly and predictably. The advent of
ChiPs embodies a modular power system design methodology enabling designers to achieve high performance, cost-effective power systems from AC or DC sources to the Point of Load using proven building blocks.
"ChiPs will enable power system architects to overcome the power density constraints imposed by conventional power solutions," said Patrizio Vinciarelli, CEO, Vicor. "ChiPs maximize performance while minimizing development cost and time to market, yielding superior solutions with the flexibility and scalability of modular building blocks."
New VI Chip Bus Converter Modules
With a nominal input voltage of 380 V and a K-factor of 1/8, Vicor's new ChiP BCM fixed-ratio power converters supply an isolated 48 V distribution bus with a peak efficiency of 98%. With its input range of 260 to 410 V, the new BCM supports outputs ranging from 32.5 V to 51.25 V. BCMs are based on Vicor's ZCS/ZVS Sine Amplitude Converter™ topology and operate at a 1.25 MHz switching frequency, providing fast response time and low noise operation.
Offered in the 6123 ChiP package, the new 380 VDC VI Chip BCMs measure 63mm by 23mm, with a height of only 7.3mm. Initially offered as a through-hole device, package options will also include SMD variants. ChiP BCMs may be paralleled to provide multi-kW arrays and are capable of bi-directional operation to support battery backup and renewable energy applications. Standard BCM features include under-over-voltage lockout, over-current, short circuit and over-temperature protection. ChiP BCMs incorporate digital telemetry and control features that can be configured to meet customer requirements.
"The roll-out of high voltage DC distribution infrastructure is yielding reduced power consumption and operational costs for datacom and industrial facilities," said Stephen Oliver, VP of VI Chip product line, Vicor. "ChiP BCMs provide superior efficiency, density and flexibility -- the hallmark benefits of the ChiP platform."
Pricing and Availability
Vicor's new 6123 VI Chip BCMs are available today. Pricing for OEM quantities is $120.00. Visit the
website for more information. To order, email
custserv@vicr.com or call 1-800-735-6200.
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About Vicor Corporation
Headquartered in Andover, Massachusetts, Vicor Corporation designs, manufactures and markets innovative, high-performance modular power components, from bricks to semiconductor-centric solutions, to enable customers to efficiently convert and manage power from the wall plug to the point of load. Complementing an extensive portfolio of patented innovations in power conversion and power distribution with significant application development expertise, Vicor offers comprehensive product lines addressing a broad range of power conversion and management requirements across all power distribution architectures, including CPA, DPA, IBA, FPA™ and CBA. Vicor focuses on solutions for performance-critical applications in the following markets: enterprise and high performance computing, telecommunications and network infrastructure, industrial equipment and automation, vehicles and transportation and aerospace and defense electronics.
www.vicorpower.com
Vicor, VI Chip, BCM, Sine Amplitude Converter and FPA are trademarks of Vicor Corporation.
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Contact: Colin Boroski Rainier Communications 508-475-0025 x 142 Email Contact