Toshiba's SLC NAND Packs in Error Correction to Remove Burden from Host Processors
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Toshiba's SLC NAND Packs in Error Correction to Remove Burden from Host Processors

Simplifies Migration to Latest NAND Process Technologies; Solves Multiple Design Challenges

IRVINE, Calif., Nov. 20, 2013 — (PRNewswire) —   Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, wants designers to have the facts when it comes to selecting the appropriate memory for industrial and consumer applications.

Single level cell (SLC) NAND has long been the choice for delivering faster read/write speeds with high reliability (when compared to MLC NAND).  Newer NAND generations require increased error correction code (ECC), which, up until now, limited existing applications (such as 1-bit ECC designs) from implementing the latest NAND generation without having to redesign using new NAND controllers with higher ECC.  Toshiba's BENANDTM[1] is SLC NAND with embedded ECC – and takes its moniker from a play on the phrase 'built-in ECC.'

In a new video from Toshiba, Brian Kumagai, director of NAND Flash Memory Products for TAEC, explores the attributes of BENAND and highlights applications where the use of embedded ECC can be beneficial.  According to Kumagai, "One of the key features of BENAND is that, even though it's performing error correction internally, it offers the user the full range of spare area that can be used for metadata."

ECC requirements for NAND keep increasing, with no end in sight.  As seen in the video, BENAND, a versatile, multi-application SLC NAND flash memory with embedded ECC, removes the burden of ECC from the host processor.  This not only saves time and simplifies the NAND flash driver software – but it also opens up a world of design possibilities.

The simple interface and high reliability of small capacity SLC NAND allows for it to be widely used in consumer and industrial applications.  Package and pin configuration compatibility are assured with general SLC NAND flash, allowing for easy replacement in existing products.

Many industrial applications have a long life expectancy.  Toshiba designed BENAND with this in mind.  With the ability to replace older generations of discrete SLC NAND, BENAND extends the product life of everything from LCD TVs and set-top boxes to robots and printers – while also potentially reducing BOM costs.

To view the full BENAND video click here. For more information on BENAND and other memory products from Toshiba, please visit http://www.toshiba.com/taec/adinfo/technologymoves or http://www.toshiba.com/taec/index.jsp.

*About Toshiba Corp. and TAEC

About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

For additional company and product information, please visit http://www.toshiba.com/taec/.

[1] BENAND is a registered trademark of Toshiba Corporation.

Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. Maximum read and write speed may vary depending on the host device, read and write conditions, and file size.  For purposes of measuring read and write speed in this context, 1 megabyte or MB = 1,000,000 bytes.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice.  Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.  In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook."  This information is available at www.chips.toshiba.com, or from your TAEC representative.

All trademarks and tradenames held within are the properties of their respective holders.

MEDIA CONTACT:
Dena Jacobson
Lages & Associates
Tel.: (949) 453-8080
Email Contact

SOURCE Toshiba America Electronic Components, Inc.

Contact:
Toshiba America Electronic Components, Inc.
Rebecca Bueno, Toshiba America Electronic Components, Inc., Tel.: (949) 462-7885
Email Contact
Web: http://www.toshiba.com/taec