Analysis of Revenue | |||
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Revenue Analysis |
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By Application |
3Q13 |
2Q13 |
3Q12 |
Computer |
1.8% |
1.5% |
1.5% |
Communications |
44.4% |
45.6% |
46.7% |
Consumer |
43.9% |
45.3% |
43.1% |
Others |
9.9% |
7.6% |
8.7% |
By Service Type |
3Q13 |
2Q13 |
3Q12 |
Wafers |
93.8% |
96.2% |
94.9% |
Mask making, testing, others |
6.2% |
3.8% |
5.1% |
By Customer Type |
3Q13 |
2Q13 |
3Q12 |
Fabless semiconductor companies |
87.7% |
87.7% |
86.8% |
Integrated device manufacturers (IDM) |
5.5% |
7.0% |
8.8% |
System companies and others |
6.8% |
5.3% |
4.4% |
By Geography |
3Q13 |
2Q13 |
3Q12 |
North America |
46.0% |
48.3% |
55.2% |
China(1) |
42.1% |
40.9% |
35.3% |
Eurasia(2) |
11.9% |
10.8% |
9.5% |
Wafer Revenue Analysis |
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By Technology (logic, memory only) |
3Q13 |
2Q13 |
3Q12 |
40/45 nm |
15.7% |
10.0% |
0.8% |
55/65 nm |
27.1% |
30.9% |
34.8% |
90 nm |
4.7% |
4.6% |
9.4% |
0.13 micrometers |
10.1% |
10.5% |
11.8% |
0.15/0.18 micrometers |
38.4% |
40.1% |
37.5% |
0.25/0.35 micrometers |
4.0% |
3.9% |
5.7% |
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Note: | |||
( 1 ) Including Hong Kong , but excluding Taiwan | |||
( 2 ) Excluding China |