European Path to 450mm and Next-Generation Fab Highlights 2013 SEMICON Europa
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European Path to 450mm and Next-Generation Fab Highlights 2013 SEMICON Europa

DRESDEN, Germany — September 10, 2013 — European semiconductor manufacturers, fabless/fab-light companies, and suppliers access to critical buyers, R&D funding, partnership opportunities, and technologies necessary to participate in the planned transition to 450mm wafer processing and other critical next-generation fab requirements will highlight  SEMICON Europa, to be held on Oct 8-10, 2013 in Dresden, Germany. In the two-day special program, “450mm: Towards a Global Cooperation,” leaders from the Global 450 Consortium (G450C), European research European Commission and other public-funded projects, and leading suppliers will present and discuss the path to participate in the future of the semiconductor manufacturing. Other conference programs at SEMICON Europa ( www.semiconeuropa.org) will explore the critical issues in Fab Management, 3D-IC and Advanced Packaging, MEMS, Test, and other subjects.

Earlier this year, the European Commission announced an ambitious new semiconductor manufacturing strategy involving over €700 million in European Commission, Member State and industry funding. This was the beginning of a wave of investment to be launched in the coming months to years to regain market share for manufacturing in Europe. Already over 120 supplier partners — 30 percent small- to medium-sized enterprises — are participating in the development and commercialization program, whose outcome will impact both current 300mm and future 450mm semiconductor manufacturing. The global gateway for public funding, access to key customers, and participation in critical technology development trends will take place through the SEMICON Europa 450mm conference and workshop program.

Keynote and featured speakers in the 450mm program include:

“The industry is at a historic turningpoint where global participation in supplier programs, consortia research activities and public-private development efforts has never been greater,” said Heinz Kundert, president of SEMI Europe. “The impact of 450mm wafer processing, as well other technical and business challenges in semiconductor and related micro and nano-electronics industries, will be at the heart of SEMICON Europa.”

SEMICON Europa comes at a time when the industry is preparing for an expected 20 percent increase in global capital spending. According to the SEMI World Fab Forecast ( www.semi.org/MarketInfo/FabDatabase), semiconductor equipment spending will double in Europe next year, from US$ 2.4 billion to over $5 billion in 2014.

SEMICON Europa ( www.semiconeuropa.org) is the leading exhibition and conference dedicated to the future of micro- and nanoelectronics design and manufacturing in Europe. Leading companies will exhibit and showcase the latest equipment, materials, software and solutions and over 100 speakers will share information on the latest trends, technologies, processes and techniques in electronic applications, design and manufacturing. SEMICON Europa will be held on Oct 8-10, 2013 in conjunction with the Plastics Electronics Conference and Exhibition ( www.plastic-electronics.org) to showcase Europe’s most innovative companies, institutions and people.

About SEMI

SEMI is the global industry association serving the nano- and microelectronic manufacturing supply chains. Our 1,900 SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit  www.semi.org.



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Beat Mueller
SEMI Europe (Berlin) 
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Deborah Geiger
SEMI Headquarters (San Jose, Calif.)
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