Intel Unveils New Technologies for Efficient Cloud Datacenters

Microserver-Optimized Switch for Software Defined Networking

Network solutions that manage data traffic across microservers can significantly impact the performance and density of the system. The unique combination of the Intel Ethernet Switch FM5224 silicon and the WindRiver Open Network Software suite will enable the industry’s first 2.5GbE, high-density, low latency, SDN Ethernet switch solutions specifically developed for microservers. The solution enhances system level innovation, and complements the integrated Intel Ethernet controller within the Intel Atom C2000 processor. Together, they can be used to create SDN solutions for the datacenter.

Switches using the new Intel Ethernet Switch FM5224 silicon can connect up to 64 microservers, providing up to 30 percent3 higher node density. They are based on Intel Open Network Platform reference design announced earlier this year.

First Demonstration of Silicon Photonics-Powered Rack

Maximum datacenter efficiency requires innovation at the silicon, system and rack level. Intel’s RSA design helps industry partners to re-architect datacenters for modularity of components (storage, CPU, memory, network) at the rack level. It provides the ability to provision or logically compose resources based on application specific workload requirements. Intel RSA also will allow for the easier replacement and configuration of components when deploying cloud computing, storage and networking resources.

Intel today demonstrated the first operational RSA-based rack equipped with the newly announced Intel Atom C2000 processors, Intel® Xeon® processors, a top-of-rack Intel SDN-enabled switch and Intel Silicon Photonics Technology. As part of the demonstration, Intel also disclosed the new MXC connector and ClearCurve* fiber technology developed by Corning* with requirements from Intel. The fiber connections are specifically designed to work with Intel Silicon Photonics components.

The collaboration underscores the tremendous need for high-speed bandwidth within datacenters. By sending photons over a thin optical fiber instead of electrical signals over a copper cable, the new technologies are capable of transferring massive amounts of data at unprecedented speeds over greater distances. The transfers can be as fast as 1.6 terabits per second4 at lengths up to 300 meters5 throughout the datacenter.

To highlight the growing range of Intel RSA implementations, Microsoft and Intel announced a collaboration to innovate on Microsoft’s next-generation RSA rack design. The goal is to bring even better utilization, economics and flexibility to Microsoft’s datacenters.

The Intel Atom C2000 product family is shipping to customers now with more than 50 designs for microservers, cold storage and networking. The products are expected to be available in the coming months from vendors including Advantech*, Dell*, Ericsson*, HP*, NEC*, Newisys*, Penguin Computing*, Portwell*, Quanta*, Supermicro*, WiWynn*, ZNYX Networks*.

More information on the announcements including Diane Bryant’s presentation, additional documents and pictures are available at http://newsroom.intel.com/docs/DOC-4267.

About Intel

Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

Intel, Atom, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance.

1 Performance based on Dynamic Web Benchmark Performance: Atom S1260 (8GB, SSD, 1GbE), Score=1522. Atom C2750(32GB, SSD,10GbE), Score=11351.

2 Performance per Watt based on Dynamic Web Benchmark: Atom S1260 (8GB,SSD, 1GbE), Score=1522, est node power=20W, PPW=76.1 Atom C2730(32GB, SSD,10GbE), Score=8778, est node power=19W, PPW=462. Source: Intel Internal measurements as of August 2013. Refer to backup for additional details.

3 Based on 2.5G port count compared to the BCM56540

4 Measured per fiber bandwidth on an Agilent Bit Error Rate Tester (BERT) that included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32 error detector. MXC connector used had 32 fibers for an actual data rate of .8 tera-bits. Mechanical models and CAD simulations show that the MXC can accommodate up to 64 fibers for a theoretical total bandwidth of 1.6 Tera-bits per second.

5 ClearCurve fiber operating at 300 meters was tested using 300 meters of new ClearCurve fiber connected to an Agilent Bit Error Rate Tester (BERT) that included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32 error detector.

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