Revenue Analysis |
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|
|
By Application |
2Q13 |
1Q13 |
2Q12 |
Computer |
1.5% |
1.3% |
2.6% |
Communications |
45.6% |
47.3% |
41.1% |
Consumer |
45.3% |
42.5% |
47.8% |
Others |
7.6% |
8.9% |
8.5% |
By Service Type |
2Q13 |
1Q13 |
2Q12 |
Wafers |
96.2% |
94.1% |
94.4% |
Mask making, testing, others |
3.8% |
5.9% |
5.6% |
By Customer Type |
2Q13 |
1Q13 |
2Q12 |
Fabless semiconductor companies |
87.7% |
88.7% |
87.4% |
Integrated device manufacturers (IDM) |
7.0% |
6.1% |
9.4% |
System companies and others |
5.3% |
5.2% |
3.2% |
By Geography |
2Q13 |
1Q13 |
2Q12 |
North America |
48.3% |
51.4% |
56.3% |
China(1) |
40.9% |
38.6% |
32.7% |
Eurasia(2) |
10.8% |
10.0% |
11.0% |
Wafer Revenue Analysis |
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|
|
By Technology (logic, memory only) |
2Q13 |
1Q13 |
2Q12 |
40/45 nm |
10.0% |
6.4% |
0.2% |
55/65 nm |
30.9% |
32.1% |
32.8% |
90 nm |
4.6% |
6.7% |
8.7% |
0.13 µm |
10.5% |
10.7% |
15.5% |
0.15/0.18 µm |
40.1% |
39.9% |
36.5% |
0.25/0.35 µm |
3.9% |
4.2% |
6.3% |
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Note: | |||
( 1 ) Including Hong Kong , but excluding Taiwan | |||
( 2 ) Excluding China |